Hisada; Takashi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hisada; Takashi.The latest application filed is for "prevention of dripping of material for material injection".
Company Profile
24.36.34
- Hisada; Takashi - Tokyo JP
- Hisada; Takashi - Hachiouji JP
- Hisada; Takashi - Kawasaki JP
- Hisada; Takashi - Hachiouji-shi JP
- Hisada; Takashi - Ritto JP
- Hisada; Takashi - Ritto-shi JP
- Hisada; Takashi - Shiga-ken JP
- Hisada; Takashi - Ritto-cho JP
Patent Activity
| Patent | Date |
|---|---|
| Prevention Of Dripping Of Material For Material Injection App 20220193805 - Aoki; Toyohiro ; et al. | 2022-06-23 |
| Forming of bump structure Grant 11,329,018 - Hisada , et al. May 10, 2 | 2022-05-10 |
| Prevention of dripping of material for material injection Grant 11,298,769 - Aoki , et al. April 12, 2 | 2022-04-12 |
| Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump Grant 11,181,704 - Aoki , et al. November 23, 2 | 2021-11-23 |
| Resist structure for forming bumps Grant 11,164,845 - Nakamura , et al. November 2, 2 | 2021-11-02 |
| Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump Grant 11,112,570 - Aoki , et al. September 7, 2 | 2021-09-07 |
| Resist Structure For Forming Bumps App 20210242164 - Nakamura; Eiji ; et al. | 2021-08-05 |
| Forming Of Bump Structure App 20210125950 - Hisada; Takashi ; et al. | 2021-04-29 |
| Assembling of chips by stacking with rotation Grant 10,991,685 - Hisada , et al. April 27, 2 | 2021-04-27 |
| Method of forming a solder bump structure Grant 10,930,609 - Aoki , et al. February 23, 2 | 2021-02-23 |
| Prevention Of Dripping Of Material For Material Injection App 20200361013 - Aoki; Toyohiro ; et al. | 2020-11-19 |
| Method of forming solder bumps Grant 10,840,202 - Aoki , et al. November 17, 2 | 2020-11-17 |
| Method of forming solder bumps Grant 10,833,035 - Aoki , et al. November 10, 2 | 2020-11-10 |
| Method of forming solder bumps Grant 10,797,011 - Aoki , et al. October 6, 2 | 2020-10-06 |
| Fabrication of solder balls with injection molded solder Grant 10,741,514 - Aoki , et al. A | 2020-08-11 |
| Assembling Of Chips By Stacking With Rotation App 20200227400 - Hisada; Takashi ; et al. | 2020-07-16 |
| Method of forming a solder bump structure Grant 10,692,829 - Aoki , et al. | 2020-06-23 |
| Fabrication Method Of High Aspect Ratio Solder Bumping With Stud Bump And Injection Molded Solder, And Flip Chip Joining With Th App 20200150362 - Aoki; Toyohiro ; et al. | 2020-05-14 |
| Method Of Forming A Solder Bump Structure App 20200152590 - Aoki; Toyohiro ; et al. | 2020-05-14 |
| Fabrication Method Of High Aspect Ratio Solder Bumping With Stud Bump And Injection Molded Solder, And Flip Chip Joining With Th App 20200150361 - Aoki; Toyohiro ; et al. | 2020-05-14 |
| Injection molded solder bumping Grant 10,615,143 - Aoki , et al. | 2020-04-07 |
| Fluid control structure Grant 10,613,282 - Cyr , et al. | 2020-04-07 |
| Method of forming a solder bump structure Grant 10,607,956 - Aoki , et al. | 2020-03-31 |
| Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump Grant 10,598,874 - Aoki , et al. | 2020-03-24 |
| Reduction of stress in via structure Grant 10,593,616 - Aoki , et al. | 2020-03-17 |
| Fabrication Of Solder Balls With Injection Molded Solder App 20200075522 - Aoki; Toyohiro ; et al. | 2020-03-05 |
| Method Of Forming A Solder Bump Structure App 20200058612 - Aoki; Toyohiro ; et al. | 2020-02-20 |
| Fabrication of solder balls with injection molded solder Grant 10,566,302 - Aoki , et al. Feb | 2020-02-18 |
| Method of forming a solder bump structure Grant 10,553,553 - Aoki , et al. Fe | 2020-02-04 |
| Fluid control structure Grant 10,371,907 - Cyr , et al. | 2019-08-06 |
| Reduction Of Stress In Via Structure App 20190214339 - Aoki; Toyohiro ; et al. | 2019-07-11 |
| Reduction of stress in via structure Grant 10,325,839 - Aoki , et al. | 2019-06-18 |
| Fabrication Method Of High Aspect Ratio Solder Bumping With Stud Bump And Injection Molded Solder, And Flip Chip Joining With The Solder Bump App 20190131266 - Aoki; Toyohiro ; et al. | 2019-05-02 |
| Method Of Forming Solder Bumps App 20180374812 - Aoki; Toyohiro ; et al. | 2018-12-27 |
| Method of forming solder bumps Grant 10,115,692 - Aoki , et al. October 30, 2 | 2018-10-30 |
| Fabrication of solder balls with injection molded solder Grant 10,103,118 - Aoki , et al. October 16, 2 | 2018-10-16 |
| Reduction Of Stress In Via Structure App 20180294213 - Aoki; Toyohiro ; et al. | 2018-10-11 |
| Reduction Of Stress In Via Structure App 20180294214 - Aoki; Toyohiro ; et al. | 2018-10-11 |
| Injection Molded Solder Bumping App 20180277509 - Aoki; Toyohiro ; et al. | 2018-09-27 |
| Fabrication Of Solder Balls With Injection Molded Solder App 20180269173 - Aoki; Toyohiro ; et al. | 2018-09-20 |
| Fluid Control Structure App 20180259728 - Cyr; Elaine ; et al. | 2018-09-13 |
| Fluid Control Structure App 20180259729 - Cyr; Elaine ; et al. | 2018-09-13 |
| Fabrication of solder balls with injection molded solder Grant 10,037,958 - Aoki , et al. July 31, 2 | 2018-07-31 |
| Injection molded solder bumping Grant 10,037,967 - Aoki , et al. July 31, 2 | 2018-07-31 |
| Fluid control structure Grant 9,989,713 - Cyr , et al. June 5, 2 | 2018-06-05 |
| Single glass panel for fire door and double glazed glass panel for fire door Grant 9,957,193 - Hisada , et al. May 1, 2 | 2018-05-01 |
| Fabrication Of Solder Balls With Injection Molded Solder App 20180108631 - Aoki; Toyohiro ; et al. | 2018-04-19 |
| Fabrication Of Solder Balls With Injection Molded Solder App 20180108630 - Aoki; Toyohiro ; et al. | 2018-04-19 |
| Method Of Forming Solder Bumps App 20180076163 - Aoki; Toyohiro ; et al. | 2018-03-15 |
| Method Of Forming Solder Bumps App 20180076165 - Aoki; Toyohiro ; et al. | 2018-03-15 |
| Method Of Forming Solder Bumps App 20180076164 - Aoki; Toyohiro ; et al. | 2018-03-15 |
| Method Of Forming A Solder Bump Structure App 20180061796 - Aoki; Toyohiro ; et al. | 2018-03-01 |
| Method Of Forming A Solder Bump Structure App 20180061797 - Aoki; Toyohiro ; et al. | 2018-03-01 |
| Method of forming a solder bump structure Grant 9,859,241 - Aoki , et al. January 2, 2 | 2018-01-02 |
| Fabrication of solder balls with injection molded solder Grant 9,837,367 - Aoki , et al. December 5, 2 | 2017-12-05 |
| Semiconductor package and method for fabricating the same Grant 8,952,551 - Hisada , et al. February 10, 2 | 2015-02-10 |
| Single Glass Panel For Fire Door And Double Glazed Glass Panel For Fire Door App 20140248447 - Hisada; Takashi ; et al. | 2014-09-04 |
| Semiconductor Package and Method for Fabricating the Same App 20120187562 - Hisada; Takashi ; et al. | 2012-07-26 |
| Wall structure Grant 7,832,158 - Hisada , et al. November 16, 2 | 2010-11-16 |
| Method of underfill air vent for flipchip BGA Grant 7,791,209 - Hisada , et al. September 7, 2 | 2010-09-07 |
| Underfill Air Vent for Flipchip BGA App 20090229513 - Hisada; Takashi ; et al. | 2009-09-17 |
| Method of underfill air vent for flipchip BGA App 20090230566 - Hisada; Takashi ; et al. | 2009-09-17 |
| Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGA Grant 7,489,519 - Nishi , et al. February 10, 2 | 2009-02-10 |
| Wall structure App 20090019810 - Hisada; Takashi ; et al. | 2009-01-22 |
| Semiconductor Package and Method for Fabricating the Same App 20080237856 - Hisada; Takashi ; et al. | 2008-10-02 |
| Internally reinforced bond pads Grant 7,273,804 - Angell , et al. September 25, 2 | 2007-09-25 |
| Internally reinforced bond pads App 20050121803 - Angell, David ; et al. | 2005-06-09 |
| Internally reinforced bond pads Grant 6,864,578 - Angell , et al. March 8, 2 | 2005-03-08 |
| Internally reinforced bond pads App 20040195642 - Angell, David ; et al. | 2004-10-07 |
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