loadpatents
name:-0.0033440589904785
name:-0.017978191375732
name:-0.00039100646972656
Hiruta; Yoichi Patent Filings

Hiruta; Yoichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hiruta; Yoichi.The latest application filed is for "semiconductor module".

Company Profile
0.16.3
  • Hiruta; Yoichi - Oita N/A JP
  • HIRUTA; Yoichi - Kitsuki-shi JP
  • Hiruta; Yoichi - Kashiwa JP
  • Hiruta; Yoichi - Matsudo JP
  • Hiruta; Yoichi - Yokohama JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device
Grant 9,059,143 - Imaizumi , et al. June 16, 2
2015-06-16
Semiconductor Module
App 20130256865 - UMEKI; Akihiro ;   et al.
2013-10-03
Semiconductor Device
App 20120025367 - IMAIZUMI; Yukari ;   et al.
2012-02-02
Reel tape for provisionally supporting a bare chip
Grant 6,182,828 - Hiruta February 6, 2
2001-02-06
Board for evaluating the characteristics of a semiconductor chip and a method for mounting a semiconductor chip thereon
Grant 6,094,057 - Hiruta , et al. July 25, 2
2000-07-25
Semiconductor device having ball grid array
Grant 5,998,861 - Hiruta December 7, 1
1999-12-07
Bare chip prober device
Grant 5,952,841 - Hiruta September 14, 1
1999-09-14
Flip chip mounting type semiconductor device
Grant 5,801,447 - Hirano , et al. September 1, 1
1998-09-01
Connecting electrode portion in semiconductor device
Grant 5,648,686 - Hirano , et al. July 15, 1
1997-07-15
Flip-chip semiconductor devices having two encapsulants
Grant 5,629,566 - Doi , et al. May 13, 1
1997-05-13
Method of manufacturing a semiconductor device
Grant 5,533,664 - Sasaki , et al. July 9, 1
1996-07-09
Semiconductor integrated circuit device having sealing means
Grant 5,463,245 - Hiruta October 31, 1
1995-10-31
Electronic device having a chip with an external bump terminal equal or smaller than a via hole on a board
Grant 5,461,197 - Hiruta , et al. October 24, 1
1995-10-24
Semiconductor device and method for mounting semiconductor wafer
Grant 5,424,917 - Hiruta June 13, 1
1995-06-13
Semiconductor device of multichip module-type
Grant 5,401,688 - Yamaji , et al. March 28, 1
1995-03-28
Method of manufacturing MOS transistor by dual species implantation and rapid annealing
Grant 4,764,478 - Hiruta August 16, 1
1988-08-16
Manufacturing MOS semiconductor device with planarized conductive layer
Grant 4,713,356 - Hiruta December 15, 1
1987-12-15

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