loadpatents
name:-0.0085561275482178
name:-0.0051140785217285
name:-0.00047397613525391
Hiruta; Hiroyoshi Patent Filings

Hiruta; Hiroyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hiruta; Hiroyoshi.The latest application filed is for "copper wire and method of manufacturing the same".

Company Profile
0.5.7
  • Hiruta; Hiroyoshi - Kitaibaraki JP
  • Hiruta; Hiroyoshi - Tokyo N/A JP
  • Hiruta; Hiroyoshi - Ibaraki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Copper alloy conductor, and trolley wire and cable using same, and copper alloy conductor fabrication method
Grant 9,255,311 - Kuroda , et al. February 9, 2
2016-02-09
Copper Wire And Method Of Manufacturing The Same
App 20140302342 - AOYAMA; Seigi ;   et al.
2014-10-09
Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor
Grant 8,845,829 - Aoyama , et al. September 30, 2
2014-09-30
Cu ALLOY MATERIAL, METHOD OF MANUFACTURING Cu ALLOY CONDUCTOR USING THE SAME, Cu ALLOY CONDUCTOR OBTAINED BY THE METHOD, AND CABLE OR TROLLEY WIRE USING THE Cu ALLOY CONDUCTOR
App 20100163139 - AOYAMA; Seigi ;   et al.
2010-07-01
Soft copper alloy, and soft copper wire or plate material
App 20080283159 - Aoyama; Seigi ;   et al.
2008-11-20
Soft copper alloy, and soft copper wire or plate material
App 20060292029 - Aoyama; Seigi ;   et al.
2006-12-28
Lead-free solder, and connection lead and electrical component using said lead-free solder
Grant 7,148,426 - Aoyama , et al. December 12, 2
2006-12-12
Copper alloy conductor, and trolley wire and cable using same, and copper alloy conductor fabrication method
App 20060157167 - Kuroda; Hiromitsu ;   et al.
2006-07-20
Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor
App 20050161129 - Aoyama, Seigi ;   et al.
2005-07-28
Lead-free solder, and connection lead and electrical component using said lead-free solder
App 20030024733 - Aoyama, Seigi ;   et al.
2003-02-06

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed