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Patent applications and USPTO patent grants for Hirtreiter; Josef.The latest application filed is for "chip package and a method for manufacturing a chip package".
Patent | Date |
---|---|
Method of fabricating a chip package Grant 8,912,087 - Hirtreiter , et al. December 16, 2 | 2014-12-16 |
Method for producing a component and device comprising a component Grant 8,872,314 - Theuss , et al. October 28, 2 | 2014-10-28 |
Chip Package And A Method For Manufacturing A Chip Package App 20140035127 - Hirtreiter; Josef ;   et al. | 2014-02-06 |
Method For Producing A Component And Device Comprising A Component App 20130277864 - Theuss; Horst ;   et al. | 2013-10-24 |
Method for producing a component and device having a component Grant 8,482,135 - Theuss , et al. July 9, 2 | 2013-07-09 |
Method for producing a component and device having a component App 20080036099 - Theuss; Horst ;   et al. | 2008-02-14 |
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