Hirota; Yousuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hirota; Yousuke.The latest application filed is for "phenol novolak resin, curable resin composition, and cured product thereof".

Company Profile

4.6.9

Hirota; Yousuke - Ichihara JP
Hirota; Yousuke - Ichihara-shi JP
Hirota; Yousuke - Chiba JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Epoxy resin, production method, epoxy resin composition and cured product of same Grant 11,015,019 - Hirota , et al. May 25, 2	2021-05-25
Phenol novolak resin, curable resin composition, and cured product thereof Grant 10,808,085 - Hirota , et al. October 20, 2	2020-10-20
Phenol Novolak Resin, Curable Resin Composition, And Cured Product Thereof App 20190225758 - Hirota; Yousuke ; et al.	2019-07-25
Epoxy Resin, Production Method, Epoxy Resin Composition And Cured Product Of Same App 20190202974 - Hirota; Yousuke ; et al.	2019-07-04
Epoxy resin, method for producing the epoxy resin, curable resin composition, and cured product thereof App 20180346639 - Hirota; Yousuke ; et al.	2018-12-06
Epoxy resin, curable resin composition, cured product, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, buildup film, buildup substrate, fiber-reinforced composite material and fiber-reinforced molded article Grant 10,113,028 - Hirota , et al. October 30, 2	2018-10-30
Epoxy Resin, Curable Resin Composition, Cured Product, Semiconductor Encapsulating Material, Semiconductor Device, Prepreg, Circuit Board, Buildup Film, Buildup Substrate, Fiber-reinforced Composite Material And Fiber-reinforced Molded Article App 20170240690 - HIROTA; Yousuke ; et al.	2017-08-24
Phenolic-hydroxyl-containing resin, epoxy resin, curable resin composition, substance obtained by curing same, and semiconductor sealant Grant 9,580,634 - Nagae , et al. February 28, 2	2017-02-28
Phenolic-hydroxyl-containing Resin, Epoxy Resin, Curable Resin Composition, Substance Obtained By Curing Same, And Semiconductor Sealant App 20150291861 - Nagae; Norio ; et al.	2015-10-15
Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material Grant 8,703,845 - Ogura , et al. April 22, 2	2014-04-22
Curable Resin Composition, Cured Product Thereof, Phenolic Resin, Epoxy Resin, And Semiconductor Sealing Material App 20130237639 - Ogura; Ichirou ; et al.	2013-09-12
Curable Resin Composition, Cured Product Thereof, Phenol Resin, Epoxy Resin, And Semiconductor Encapsulating Material App 20130184377 - Ogura; Ichirou ; et al.	2013-07-18

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