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Patent applications and USPTO patent grants for Hirose; Toshifumi.The latest application filed is for "curing composition and method for applying alkyd coating material with the same".
Patent | Date |
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Curing composition and method for applying alkyd coating material with the same Grant 7,151,128 - Fujimoto , et al. December 19, 2 | 2006-12-19 |
Curing composition and method for applying alkyd coating material with the same App 20040138398 - Fujimoto, Toyohisa ;   et al. | 2004-07-15 |
Process for fitting glass members onto vehicles Grant 5,952,052 - Hattori , et al. September 14, 1 | 1999-09-14 |
Curable resin composition with improved adhesion of coatings Grant 5,910,555 - Ueda , et al. June 8, 1 | 1999-06-08 |
Curable resin composition Grant 5,889,124 - Ando , et al. March 30, 1 | 1999-03-30 |
Silicon-containing polymer, process for preparing the same and monomer thereof Grant 5,691,433 - Kotani , et al. November 25, 1 | 1997-11-25 |
Pressure-sensitive adhesive material Grant 5,631,082 - Hirose , et al. May 20, 1 | 1997-05-20 |
Curable composition and process for producing molded articles using the same Grant 5,623,030 - Tsumura , et al. April 22, 1 | 1997-04-22 |
Method for decomposing polysiloxane Grant 5,504,235 - Hirose , et al. April 2, 1 | 1996-04-02 |
Curable composition Grant 5,063,270 - Yukimoto , et al. * November 5, 1 | 1991-11-05 |
Curable polymer composition Grant 4,963,626 - Hirose , et al. October 16, 1 | 1990-10-16 |
Curable composition Grant 4,923,927 - Hirose , et al. May 8, 1 | 1990-05-08 |
Curable composition of oxyalkylene polymer Grant 4,906,707 - Yukimoto , et al. March 6, 1 | 1990-03-06 |
Curable polymer composition comprising organic polymer having silicon-contaiing reactive group Grant 4,837,401 - Hirose , et al. June 6, 1 | 1989-06-06 |
Process for forming a pressure sensitive adhesive on a substrate Grant 4,735,829 - Hirose , et al. April 5, 1 | 1988-04-05 |
Pressure sensitive adhesive composition Grant 4,665,127 - Hirose , et al. May 12, 1 | 1987-05-12 |
Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer Grant 4,657,986 - Isayama , et al. April 14, 1 | 1987-04-14 |
Curable composition of phenolic resin and polyether containing silicone containing reactive group Grant 4,631,322 - Isayama , et al. December 23, 1 | 1986-12-23 |
Curing composition containing polyether having reactive silicon-containing group and a (meth)acrylate polymer Grant 4,593,068 - Hirose , et al. June 3, 1 | 1986-06-03 |
Curable composition Grant 4,543,403 - Isayama , et al. September 24, 1 | 1985-09-24 |
Primer composition Grant 4,513,061 - Kawakubo , et al. April 23, 1 | 1985-04-23 |
Process for improving weather resistant adhesion of a coating to glass surface Grant 4,496,611 - Kawakubo , et al. January 29, 1 | 1985-01-29 |
Pressure sensitive adhesive composition Grant 4,463,115 - Hirose , et al. July 31, 1 | 1984-07-31 |
Room temperature curing composition Grant 4,444,974 - Takase , et al. April 24, 1 | 1984-04-24 |
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