Hirose; Shigeyuki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hirose; Shigeyuki.The latest application filed is for "polyamide resin".
- Hirose; Shigeyuki - Kanagawa N/A JP
- Hirose; Shigeyuki - Niigata JP
| Patent | Date |
|---|---|
| Polyamide resin Grant 9,163,117 - Mitadera , et al. October 20, 2 | 2015-10-20 |
| Polyamide Resin App 20130066041 - Mitadera; Jun ; et al. | 2013-03-14 |
| Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate Grant 8,128,782 - Yonehama , et al. March 6, 2 | 2012-03-06 |
| Amine Epoxy Resin Curing Agent, Gas Barrier Epoxy Resin Composition Comprising The Curing Agent, Coating Agent, And Adhesive Agent For Laminate App 20100160494 - Yonehama; Shinichi ; et al. | 2010-06-24 |
| Laminate Film App 20090239069 - Yonehama; Shinichi ; et al. | 2009-09-24 |
| Process for producing hydrogen-containing gas Grant 6,926,881 - Hirose , et al. August 9, 2 | 2005-08-09 |
| Process for producing hydrogen-containing gas Grant 6,916,458 - Kushida , et al. July 12, 2 | 2005-07-12 |
| Process for producing hydrogen-containing gas App 20030157019 - Kushida, Yasuhiro ; et al. | 2003-08-21 |
| Process for producing hydrogen-containing gas App 20030095919 - Hirose, Shigeyuki ; et al. | 2003-05-22 |
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