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Patent applications and USPTO patent grants for HIROKAWA; Yasushi.The latest application filed is for "multilayer film and heat-resistant adhesive tape".
Patent | Date |
---|---|
Multilayer Film And Heat-resistant Adhesive Tape App 20210130653 - Fujiwara; Junpei ;   et al. | 2021-05-06 |
Thermoplastic Resin Sheet Having Hairlike Bodies And Molded Product Thereof App 20190283301 - FUJIWARA; Junpei ;   et al. | 2019-09-19 |
Multilayer styrenic resin sheet Grant 9,646,863 - Aoki , et al. May 9, 2 | 2017-05-09 |
Multilayer Styrenic Resin Sheet App 20130337202 - Aoki; Yutaka ;   et al. | 2013-12-19 |
Surface Conductive Multilayered Sheet App 20130251970 - Aoki; Yutaka ;   et al. | 2013-09-26 |
Embossed Carrier Tape And Method Of Production Thereof App 20120094086 - Takei; Atsushi ;   et al. | 2012-04-19 |
Conductive composite sheeting Grant 7,794,807 - Miyakawa , et al. September 14, 2 | 2010-09-14 |
Conductive Composite Sheeting App 20070231549 - Miyakawa; Takeshi ;   et al. | 2007-10-04 |
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