Hirokawa; Suguru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hirokawa; Suguru.The latest application filed is for "wafer holding device and wafer chucking and dechucking method".

Company Profile

1.6.4

Hirokawa; Suguru - Ehime JP
Hirokawa; Suguru - Saijo JP
Hirokawa, Suguru - Saijo-shi JP
Hirokawa; Suguru - Saijyou JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer holding device and wafer chucking and dechucking method Grant 10,896,843 - Sato , et al. January 19, 2	2021-01-19
Wafer Holding Device And Wafer Chucking And Dechucking Method App 20180277418 - Sato; Fumiaki ; et al.	2018-09-27
Ion implantation apparatus and control method for ion implantation apparatus Grant 9,666,413 - Fujii , et al. May 30, 2	2017-05-30
Ion Implantation Apparatus And Control Method For Ion Implantation Apparatus App 20150364299 - Fujii; Yoshito ; et al.	2015-12-17
Method of controlling mover device Grant 7,597,531 - Okada , et al. October 6, 2	2009-10-06
Mover device and semiconductor manufacturing apparatus and method Grant 7,187,143 - Okada , et al. March 6, 2	2007-03-06
Method of controlling mover device, cooperative device of mover device, cooperative method of mover device, semiconductor manufacturing device, liquid crystal manufacturing device, and mechanical scan ion implantation device App 20050188924 - Okada, Keiji ; et al.	2005-09-01
Mover device and semiconductor manufacturing apparatus and method App 20040194565 - Okada, Keiji ; et al.	2004-10-07
Ion implantation device Grant 5,608,223 - Hirokawa , et al. March 4, 1	1997-03-04
Ion implantation device Grant 5,525,807 - Hirokawa , et al. June 11, 1	1996-06-11

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