loadpatents
name:-0.0048589706420898
name:-0.015140056610107
name:-0.00094008445739746
Hiroi; Atsushi Patent Filings

Hiroi; Atsushi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hiroi; Atsushi.The latest application filed is for "protection device, image forming apparatus and method, and non-transitory computer readable medium".

Company Profile
0.9.4
  • Hiroi; Atsushi - Kanagawa JP
  • Hiroi; Atsushi - Gifu JP
  • Hiroi; Atsushi - Oogaki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Protection device, image forming apparatus and method, and non-transitory computer readable medium
Grant 9,104,167 - Morizaki , et al. August 11, 2
2015-08-11
Protection Device, Image Forming Apparatus And Method, And Non-transitory Computer Readable Medium
App 20140133874 - MORIZAKI; Sou ;   et al.
2014-05-15
Heat-responsive switch, fixing device, and image forming apparatus
Grant 8,626,006 - Masumura , et al. January 7, 2
2014-01-07
Thermally-actuated switch, fixing device, and image forming apparatus
Grant 8,588,629 - Hiroi , et al. November 19, 2
2013-11-19
Thermally-actuated Switch, Fixing Device, And Image Forming Apparatus
App 20120251137 - HIROI; Atsushi ;   et al.
2012-10-04
Heat-responsive Switch, Fixing Device, And Image Forming Apparatus
App 20120251136 - MASUMURA; Tomohiro ;   et al.
2012-10-04
Thermal Switch, Mounting Structure, Fixing Device, And Image Forming Apparatus
App 20120243889 - SAITO; Katsuya ;   et al.
2012-09-27
Electronic-parts mounting board and electronic-parts mounting board frame
Grant 5,252,784 - Asai , et al. October 12, 1
1993-10-12
Method of manufacturing a high lead count circuit board
Grant 5,206,188 - Hiroi , et al. April 27, 1
1993-04-27
High lead count circuit board for connecting electronic components to an external circuit
Grant 5,151,771 - Hiroi , et al. September 29, 1
1992-09-29
Method of manufacturing a substrate for mounting electronic components
Grant 4,908,933 - Sagisaka , et al. March 20, 1
1990-03-20

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