loadpatents
Patent applications and USPTO patent grants for Hiroe; Toshio.The latest application filed is for "wafer thinning method in wafer treating system".
Patent | Date |
---|---|
Microelectromechanical system megasonic transducer Grant 8,957,564 - Hiroe , et al. February 17, 2 | 2015-02-17 |
Wafer Thinning Method In Wafer Treating System App 20110256728 - HIROE; Toshio ;   et al. | 2011-10-20 |
Substrate processing apparatus Grant 7,938,129 - Hiroe , et al. May 10, 2 | 2011-05-10 |
Substrate processing apparatus and substrate processing method Grant 7,615,118 - Fukui , et al. November 10, 2 | 2009-11-10 |
Substrate processing apparatus and substrate processing method Grant 7,541,285 - Abiko , et al. June 2, 2 | 2009-06-02 |
Substrate treating apparatus Grant 7,422,681 - Hiroe , et al. September 9, 2 | 2008-09-09 |
Substrate Processing Apparatus App 20080083501 - ARAI; Kenichiro ;   et al. | 2008-04-10 |
Wafer Thinning Apparatus And Wafer Treating System App 20070277861 - Hiroe; Toshio ;   et al. | 2007-12-06 |
Substrate Processing Apparatus App 20070240743 - Hiroe; Toshio ;   et al. | 2007-10-18 |
Substrate treating apparatus Grant 7,267,128 - Hiroe , et al. September 11, 2 | 2007-09-11 |
Substrate treating apparatus Grant 7,243,911 - Abiko , et al. July 17, 2 | 2007-07-17 |
Substrate Processing Apparatus And Substrate Processing Method App 20070072436 - FUKUI; Katsuhiro ;   et al. | 2007-03-29 |
Substrate Processing Apparatus And Substrate Processing Method App 20070042511 - ABIKO; Yoshitaka ;   et al. | 2007-02-22 |
Substrate treating apparatus App 20050258085 - Hiroe, Toshio ;   et al. | 2005-11-24 |
Substrate treating apparatus App 20050161839 - Abiko, Yoshitaka ;   et al. | 2005-07-28 |
Cleaning apparatus and substrate processing apparatus App 20040211449 - Yokomoto, Ryu ;   et al. | 2004-10-28 |
Substrate processing apparatus App 20040200415 - Maegawa, Tadashi ;   et al. | 2004-10-14 |
Substrate treating apparatus App 20040071531 - Hiroe, Toshio ;   et al. | 2004-04-15 |
Substrate holding apparatus App 20030178379 - Hasegawa, Koji ;   et al. | 2003-09-25 |
Dipping type surface treatment apparatus Grant 5,191,908 - Hiroe , et al. March 9, 1 | 1993-03-09 |
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