Hirayama; Takao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hirayama; Takao.The latest application filed is for "semiconductor module includes semiconductor chip initialized by reset signal".

Company Profile

0.8.4

Hirayama; Takao - Tokyo JP
Hirayama; Takao - Ibaraki-ken JP
HIRAYAMA, TAKAO - KASHIMA-GUN JP
Hirayama; Takao - Hitachi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor module includes semiconductor chip initialized by reset signal Grant 8,953,406 - Nishio , et al. February 10, 2	2015-02-10
Semiconductor Module Includes Semiconductor Chip Initialized By Reset Signal App 20120268173 - NISHIO; Yoji ; et al.	2012-10-25
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film Grant 7,071,243 - Sato , et al. July 4, 2	2006-07-04
Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, resist pattern and substrate having the resist pattern laminated thereon Grant 7,049,036 - Satou , et al. May 23, 2	2006-05-23
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film App 20040214924 - Sato, Kuniaki ; et al.	2004-10-28
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film Grant 6,692,793 - Sato , et al. February 17, 2	2004-02-17
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film App 20010053437 - Sato, Kuniaki ; et al.	2001-12-20
Photo Curable Resin Composition And Photosensitive Element App 20010003759 - SATO, KUNIAKI ; et al.	2001-06-14
Photosensitive resin composition Grant 6,238,840 - Hirayama , et al. May 29, 2	2001-05-29
Ring oscillator generating pulse signal at constant pulse period under unstable power voltage Grant 6,100,768 - Hirayama August 8, 2	2000-08-08
Water-dispersed resin composition Grant 4,301,048 - Hirayama , et al. November 17, 1	1981-11-17

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