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name:-0.28022694587708
name:-0.038665056228638
name:-0.0022640228271484
HIRAYAMA; Takamasa Patent Filings

HIRAYAMA; Takamasa

Patent Applications and Registrations

Patent applications and USPTO patent grants for HIRAYAMA; Takamasa.The latest application filed is for "pressure-sensitive adhesive sheet".

Company Profile
0.4.16
  • HIRAYAMA; Takamasa - Ibaraki-shi Osaka
  • HIRAYAMA; Takamasa - Osaka JP
  • Hirayama; Takamasa - Ibaraki JP
  • HIRAYAMA; Takamasa - Osakai JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Pressure-sensitive Adhesive Sheet
App 20220195256 - KAWAMOTO; Takatoshi ;   et al.
2022-06-23
Pressure-sensitive Adhesive Sheet
App 20220119685 - KAWAMOTO; Takatoshi ;   et al.
2022-04-21
Method For Manufacturing Electronic Component
App 20220059391 - UENO; Shusaku ;   et al.
2022-02-24
Adhesive Sheet
App 20210309890 - UENO; Shusaku ;   et al.
2021-10-07
Adhesive Sheet
App 20210309889 - UENO; Shusaku ;   et al.
2021-10-07
Production Method For Electronic Component And Pressure-sensitive Adhesive Sheet To Be Used In The Production Method
App 20140044957 - Hirayama; Takamasa ;   et al.
2014-02-13
Heat-peelable Pressure-sensitive Adhesive Sheet
App 20130260120 - HIRAYAMA; Takamasa ;   et al.
2013-10-03
Heat-resistant Pressure-sensitive Adhesive Tape For Production Of Semiconductor Device And Method For Producing Semiconductor Device Using The Tape
App 20130240141 - SOEJIMA; Kazuki ;   et al.
2013-09-19
Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet
Grant 8,524,361 - Soejima , et al. September 3, 2
2013-09-03
Process for producing organic electroluminescent panel
Grant 8,409,884 - Hirayama , et al. April 2, 2
2013-04-02
Pressure-sensitive Adhesive Tape For Temporary Fixing Of Electronic Part
App 20120237764 - SOEJIMA; Kazuki ;   et al.
2012-09-20
Adhesive Sheet, Process For Producing The Same, And Method Of Cutting Multilayered Ceramic Sheet
App 20110200744 - HIRAYAMA; Takamasa ;   et al.
2011-08-18
Process For Producing Organic Electroluminescent Panel
App 20110124136 - Hirayama; Takamasa ;   et al.
2011-05-26
Heat-peelable Pressure-sensitive Adhesive Sheet For Cutting Laminated Ceramic Sheet And Method For Cut-processing Laminated Ceramic Sheet
App 20100224316 - SOEJIMA; Kazuki ;   et al.
2010-09-09
Re-releasable Adhesive Agent And Re-releasable Adhesive Sheet
App 20100028669 - HABU; Takashi ;   et al.
2010-02-04
Adhesive Sheet, Process For Producing The Same, And Method Of Cutting Multilayered Ceramic Sheet
App 20080038540 - HIRAYAMA; Takamasa ;   et al.
2008-02-14

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