Hirasawa; Yutaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hirasawa; Yutaka.The latest application filed is for "loop material sewing method and loop sewing machine".

Company Profile

0.23.11

Hirasawa; Yutaka - Tokyo JP
Hirasawa; Yutaka - Ageo JP
Hirasawa, Yutaka - Ageo-shi JP
Hirasawa, Yutaka - Okegawa-shi JP
Hirasawa; Yutaka - Okegawa JP
Hirasawa; Yutaka - Kokubunji JP
Hirasawa; Yutaka - Ohmiya JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Loop material sewing method and loop sewing machine Grant 9,873,965 - Hirasawa , et al. January 23, 2	2018-01-23
Loop Material Sewing Method And Loop Sewing Machine App 20160237605 - HIRASAWA; Yutaka ; et al.	2016-08-18
LED lamp Grant D550,869 - Hoshikawa , et al. September 11, 2	2007-09-11
LED lamp Grant D550,379 - Hoshikawa , et al. September 4, 2	2007-09-04
LED lamp Grant D546,985 - Hoshikawa , et al. July 17, 2	2007-07-17
LED lamp Grant D520,657 - Hoshikawa , et al. May 9, 2	2006-05-09
LED holder Grant D508,234 - Moriyama , et al. August 9, 2	2005-08-09
Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same Grant 6,902,824 - Yamamoto , et al. June 7, 2	2005-06-07
LED holder Grant D505,663 - Moriyama , et al. May 31, 2	2005-05-31
LED holder Grant D505,662 - Moriyama , et al. May 31, 2	2005-05-31
Method for manufacturing printed wiring board Grant 6,827,867 - Yamamoto , et al. December 7, 2	2004-12-07
Manufacturing process for printed wiring board Grant 6,716,572 - Yamamoto , et al. April 6, 2	2004-04-06
Filtration method of copper electrolyte Grant 6,616,827 - Nabekura , et al. September 9, 2	2003-09-09
Electolytic copper foil with carrier foil and method for manufacturing the same Grant 6,610,418 - Yoshioka , et al. August 26, 2	2003-08-26
Surface-treated copper foil and method for producing the same Grant 6,605,369 - Takahashi , et al. August 12, 2	2003-08-12
Surface treated copper foil, electrodeposited copper foil with carrier, manufacture method for the electrodeposited copper foil with carrier, and copper clad laminate App 20030148136 - Yamamoto, Takuya ; et al.	2003-08-07
Electrodeposited copper foil, method of inspecting physical properties thereof, and copper-clad laminate employing the electrodeposited copper foil Grant 6,479,170 - Takahashi , et al. November 12, 2	2002-11-12
Composite material used in making printed wiring boards App 20020090497 - Kataoka, Takashi ; et al.	2002-07-11
Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same App 20020079133 - Yamamoto, Takuya ; et al.	2002-06-27
Manufacturing process for printed wiring board App 20020081530 - Yamamoto, Takuya ; et al.	2002-06-27
Making and using an ultra-thin copper foil App 20020070120 - Kataoka, Takashi ; et al.	2002-06-13
Manufacturing method of electrodeposited copper foil and electrodeposited copper foil App 20020015833 - Takahashi, Naotomi ; et al.	2002-02-07
Copper foil circuit with a carrier, method for manufacturing printed wiring board using the same, and printed wiring board App 20020004124 - Hirasawa, Yutaka ; et al.	2002-01-10
Filtration method of copper electrolyte App 20010042688 - Nabekura, Kazuyoshi ; et al.	2001-11-22
Method for manufacturing printed wiring board App 20010042732 - Yamamoto, Takuya ; et al.	2001-11-22
Electrodeposited copper foil, method of inspecting physical properties thereof, and copper - clad laminate employing the electrodeposited copper foil App 20010008091 - Takahashi, Naotomi ; et al.	2001-07-19
Copper foil for a printed circuit board, a process and an apparatus for producing the same Grant 5,833,819 - Ohara , et al. November 10, 1	1998-11-10
Copper-clad laminate and printed wiring board Grant 5,545,466 - Saida , et al. August 13, 1	1996-08-13
Lan control system Grant 5,504,866 - Hirasawa April 2, 1	1996-04-02
Computer system capable of disconnecting itself from a lan Grant 5,341,363 - Hirasawa August 23, 1	1994-08-23
Routing method in a computer communication network system Grant 5,029,075 - Hirasawa July 2, 1	1991-07-02
Data alignment correction apparatus for properly formatting data structures for different computer architectures Grant 4,992,931 - Hirasawa February 12, 1	1991-02-12
Local area network system with a multi-computer system coupled thereto and method for controlling the same Grant 4,887,075 - Hirasawa December 12, 1	1989-12-12
Base material having a dyed membrane on the surface thereof, and method for dyeing a membrane thereon Grant 4,675,252 - Hashimoto , et al. June 23, 1	1987-06-23

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