loadpatents
name:-0.037431955337524
name:-0.022731065750122
name:-0.021990060806274
Hirao; Akira Patent Filings

Hirao; Akira

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hirao; Akira.The latest application filed is for "separation and bonding method for adherend".

Company Profile
20.17.39
  • Hirao; Akira - Ibaraki JP
  • HIRAO; Akira - Ibaraki-shi Osaka
  • HIRAO; Akira - Nagano JP
  • Hirao; Akira - Matsumoto JP
  • HIRAO; Akira - Matsumoto-city JP
  • HIRAO; Akira - Osaka JP
  • HIRAO; Akira - Yokohama-shi JP
  • Hirao; Akira - Kanagawa JP
  • Hirao; Akira - Ohbu JP
  • Hirao; Akira - Kawasaki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Resin sheet and adhesive-layer-having resin sheet
Grant 11,434,341 - Yamanari , et al. September 6, 2
2022-09-06
Resin sheet and adhesive-layer-having resin sheet
Grant 11,401,395 - Yamanari , et al. August 2, 2
2022-08-02
Separation And Bonding Method For Adherend
App 20220112410 - AWANE; Ryo ;   et al.
2022-04-14
Semiconductor Device
App 20220077044 - MITSUMOTO; Takahiro ;   et al.
2022-03-10
Semiconductor device having circuit board interposed between two conductor layers
Grant 11,251,163 - Hori , et al. February 15, 2
2022-02-15
Separation Method And Bonding Method For Adherend
App 20220032600 - AWANE; Ryo ;   et al.
2022-02-03
Semiconductor Device Having Circuit Board Interposed Between Two Conductor Layers
App 20210193628 - HORI; Motohito ;   et al.
2021-06-24
Semiconductor Device
App 20210184023 - HORI; Motohito ;   et al.
2021-06-17
Semiconductor Module
App 20210125916 - HIRAO; Akira ;   et al.
2021-04-29
Laminate sheet and roll
Grant 10,961,417 - Suzuki , et al. March 30, 2
2021-03-30
Electrical Debonding Type Adhesive Sheet, Joined Body, And Debonding Method For Joined Body
App 20210002516 - AKAMATSU; Kaori ;   et al.
2021-01-07
Electrical Debonding Type Adhesive Sheet, Joined Body, And Joining And Separation Method For Adherend
App 20200406582 - AKAMATSU; Kaori ;   et al.
2020-12-31
Semiconductor equipment
Grant 10,867,980 - Hori , et al. December 15, 2
2020-12-15
Thermally conductive pressure-sensitive adhesive sheet
Grant 10,815,396 - Suzuki , et al. October 27, 2
2020-10-27
Pressure-sensitive Adhesive Layer And Pressure-sensitive Adhesive Sheet
App 20200263060 - SUZUKI; Tatsuya ;   et al.
2020-08-20
Resin Sheet And Adhesive-layer-having Resin Sheet
App 20200224000 - YAMANARI; Yusuke ;   et al.
2020-07-16
Pressure-sensitive adhesive sheet and magnetic disc device
Grant 10,647,891 - Furuta , et al.
2020-05-12
Electronic Device, Cover Seal and Method for Applying Cover Seal
App 20200126597 - FURUTA; Kenji ;   et al.
2020-04-23
Semiconductor Equipment
App 20200118986 - HORI; Motohito ;   et al.
2020-04-16
Pressure-sensitive adhesive sheet and magnetic disc device
Grant 10,593,353 - Furuta , et al.
2020-03-17
Electrically Debondable Adhesive Composition, Adhesive Sheet, And Adhered Body
App 20200002581 - AKAMATSU; Kaori ;   et al.
2020-01-02
Pressure-Sensitive Adhesive Sheet and Use Thereof
App 20190284447 - FURUTA; Kenji ;   et al.
2019-09-19
Pressure-Sensitive Adhesive Sheet and Magnetic Disc Device
App 20190284445 - FURUTA; Kenji ;   et al.
2019-09-19
Laminate Sheet And Roll
App 20190225838 - Suzuki; Tatsuya ;   et al.
2019-07-25
Pressure-Sensitive Adhesive Sheet and Magnetic Disc Device
App 20190206427 - Furuta; Kenji ;   et al.
2019-07-04
Conductive pressure-sensitive adhesive tape
Grant 10,329,457 - Hirao , et al.
2019-06-25
Pressure-sensitive Adhesive Sheet
App 20190127610 - SUZUKI; Tatsuya ;   et al.
2019-05-02
Thermally Conductive Pressure-sensitive Adhesive Sheet
App 20190127611 - SUZUKI; Tatsuya ;   et al.
2019-05-02
Semiconductor device with heat dissipation and method of making same
Grant 10,090,222 - Hirao , et al. October 2, 2
2018-10-02
Semiconductor Device With Heat Dissipation And Method Of Making Same
App 20180240730 - HIRAO; Akira ;   et al.
2018-08-23
Conductive Pressure-sensitive Adhesive Tape
App 20180086946 - HIRAO; Akira ;   et al.
2018-03-29
Filler-containing Pressure-sensitive Adhesive Tape And Method Of Producing Filler-containing Pressure-sensitive Adhesive Tape
App 20180086954 - MORIOKA; Ryo ;   et al.
2018-03-29
Conductive Pressure-sensitive Adhesive Tape And Method Of Producing Conductive Pressure-sensitive Adhesive Tape
App 20180086949 - MORIOKA; Ryo ;   et al.
2018-03-29
Pressure-sensitive adhesive sheet and magnetic disk drive
Grant 9,683,138 - Furuta , et al. June 20, 2
2017-06-20
Pressure-sensitive Adhesive Sheet And Magnetic Disk Drive
App 20160376473 - FURUTA; Kenji ;   et al.
2016-12-29
Wireless Communication Apparatus And Wireless Communication Method
App 20160249262 - HIRAO; Akira
2016-08-25
Radiant Heat Conduction-suppressing Sheet
App 20130344308 - Hyodo; Tomonori ;   et al.
2013-12-26
Photocurable acrylic viscoelastic material composition, acrylic viscoelastic material, acrylic viscoelastic material layer tape or sheet and proceed for producing the same
Grant 8,598,250 - Hirao , et al. December 3, 2
2013-12-03
Foam, Production Method For Foam, And Functional Foam
App 20130224467 - Hirao; Akira ;   et al.
2013-08-29
W/o Emulsion, Foam, And Functional Foam
App 20130216814 - Hirao; Akira ;   et al.
2013-08-22
Composite Sheet
App 20130210301 - Hirao; Akira ;   et al.
2013-08-15
Method Of Reusably Separating Two Adhered Plates And Apparatus Used For The Method
App 20130025777 - FUJITA; Masato ;   et al.
2013-01-31
Cross-linked Resin Foam And Process For Producing The Same
App 20110275727 - Yamamoto; Takayuki ;   et al.
2011-11-10
Ultraviolet-curable Pressure-sensitive Adhesive Composition, Ultraviolet-curable Pressure-sensitive Adhesive Sheet And Process For Producing The Same
App 20110003135 - Hirao; Akira ;   et al.
2011-01-06
Heat-expandable Removable Acrylic Pressure-sensitive Adhesive Tape Or Sheet
App 20100215947 - Yamanaka; Eiji ;   et al.
2010-08-26
Thermally-foamable Re-releasable Acrylic Pressure-sensitive Adhesive Tape Or Sheet
App 20100075129 - Nagasaki; Kunio ;   et al.
2010-03-25
Photocurable Acrylic Viscoelastic Material Composition, Acrylic Viscoelastic Material, Acrylic Viscoelastic Material Layer Tape Or Sheet And Proceed For Producing The Same
App 20090186164 - HIRAO; Akira ;   et al.
2009-07-23
Radio communication system
Grant 6,640,100 - Kojima , et al. October 28, 2
2003-10-28
Internally meshing planetary gear structure and flexible meshing type gear meshing structure
Grant 5,429,556 - Ishida , et al. July 4, 1
1995-07-04
Internally meshing planetary gear structure and flexible meshing type gear meshing structure
Grant 5,388,483 - Ishida , et al. February 14, 1
1995-02-14
Polymers of substituted 1,3-butadiene compounds having reactive silyl groups and process for their preparation
Grant 4,730,031 - Sato , et al. March 8, 1
1988-03-08

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