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Resin sheet and adhesive-layer-having resin sheet Grant 11,434,341 - Yamanari , et al. September 6, 2 | 2022-09-06 |
Resin sheet and adhesive-layer-having resin sheet Grant 11,401,395 - Yamanari , et al. August 2, 2 | 2022-08-02 |
Separation And Bonding Method For Adherend App 20220112410 - AWANE; Ryo ;   et al. | 2022-04-14 |
Semiconductor Device App 20220077044 - MITSUMOTO; Takahiro ;   et al. | 2022-03-10 |
Semiconductor device having circuit board interposed between two conductor layers Grant 11,251,163 - Hori , et al. February 15, 2 | 2022-02-15 |
Separation Method And Bonding Method For Adherend App 20220032600 - AWANE; Ryo ;   et al. | 2022-02-03 |
Semiconductor Device Having Circuit Board Interposed Between Two Conductor Layers App 20210193628 - HORI; Motohito ;   et al. | 2021-06-24 |
Semiconductor Device App 20210184023 - HORI; Motohito ;   et al. | 2021-06-17 |
Semiconductor Module App 20210125916 - HIRAO; Akira ;   et al. | 2021-04-29 |
Laminate sheet and roll Grant 10,961,417 - Suzuki , et al. March 30, 2 | 2021-03-30 |
Electrical Debonding Type Adhesive Sheet, Joined Body, And Debonding Method For Joined Body App 20210002516 - AKAMATSU; Kaori ;   et al. | 2021-01-07 |
Electrical Debonding Type Adhesive Sheet, Joined Body, And Joining And Separation Method For Adherend App 20200406582 - AKAMATSU; Kaori ;   et al. | 2020-12-31 |
Semiconductor equipment Grant 10,867,980 - Hori , et al. December 15, 2 | 2020-12-15 |
Thermally conductive pressure-sensitive adhesive sheet Grant 10,815,396 - Suzuki , et al. October 27, 2 | 2020-10-27 |
Pressure-sensitive Adhesive Layer And Pressure-sensitive Adhesive Sheet App 20200263060 - SUZUKI; Tatsuya ;   et al. | 2020-08-20 |
Resin Sheet And Adhesive-layer-having Resin Sheet App 20200224000 - YAMANARI; Yusuke ;   et al. | 2020-07-16 |
Pressure-sensitive adhesive sheet and magnetic disc device Grant 10,647,891 - Furuta , et al. | 2020-05-12 |
Electronic Device, Cover Seal and Method for Applying Cover Seal App 20200126597 - FURUTA; Kenji ;   et al. | 2020-04-23 |
Semiconductor Equipment App 20200118986 - HORI; Motohito ;   et al. | 2020-04-16 |
Pressure-sensitive adhesive sheet and magnetic disc device Grant 10,593,353 - Furuta , et al. | 2020-03-17 |
Electrically Debondable Adhesive Composition, Adhesive Sheet, And Adhered Body App 20200002581 - AKAMATSU; Kaori ;   et al. | 2020-01-02 |
Pressure-Sensitive Adhesive Sheet and Use Thereof App 20190284447 - FURUTA; Kenji ;   et al. | 2019-09-19 |
Pressure-Sensitive Adhesive Sheet and Magnetic Disc Device App 20190284445 - FURUTA; Kenji ;   et al. | 2019-09-19 |
Laminate Sheet And Roll App 20190225838 - Suzuki; Tatsuya ;   et al. | 2019-07-25 |
Pressure-Sensitive Adhesive Sheet and Magnetic Disc Device App 20190206427 - Furuta; Kenji ;   et al. | 2019-07-04 |
Conductive pressure-sensitive adhesive tape Grant 10,329,457 - Hirao , et al. | 2019-06-25 |
Pressure-sensitive Adhesive Sheet App 20190127610 - SUZUKI; Tatsuya ;   et al. | 2019-05-02 |
Thermally Conductive Pressure-sensitive Adhesive Sheet App 20190127611 - SUZUKI; Tatsuya ;   et al. | 2019-05-02 |
Semiconductor device with heat dissipation and method of making same Grant 10,090,222 - Hirao , et al. October 2, 2 | 2018-10-02 |
Semiconductor Device With Heat Dissipation And Method Of Making Same App 20180240730 - HIRAO; Akira ;   et al. | 2018-08-23 |
Conductive Pressure-sensitive Adhesive Tape App 20180086946 - HIRAO; Akira ;   et al. | 2018-03-29 |
Filler-containing Pressure-sensitive Adhesive Tape And Method Of Producing Filler-containing Pressure-sensitive Adhesive Tape App 20180086954 - MORIOKA; Ryo ;   et al. | 2018-03-29 |
Conductive Pressure-sensitive Adhesive Tape And Method Of Producing Conductive Pressure-sensitive Adhesive Tape App 20180086949 - MORIOKA; Ryo ;   et al. | 2018-03-29 |
Pressure-sensitive adhesive sheet and magnetic disk drive Grant 9,683,138 - Furuta , et al. June 20, 2 | 2017-06-20 |
Pressure-sensitive Adhesive Sheet And Magnetic Disk Drive App 20160376473 - FURUTA; Kenji ;   et al. | 2016-12-29 |
Wireless Communication Apparatus And Wireless Communication Method App 20160249262 - HIRAO; Akira | 2016-08-25 |
Radiant Heat Conduction-suppressing Sheet App 20130344308 - Hyodo; Tomonori ;   et al. | 2013-12-26 |
Photocurable acrylic viscoelastic material composition, acrylic viscoelastic material, acrylic viscoelastic material layer tape or sheet and proceed for producing the same Grant 8,598,250 - Hirao , et al. December 3, 2 | 2013-12-03 |
Foam, Production Method For Foam, And Functional Foam App 20130224467 - Hirao; Akira ;   et al. | 2013-08-29 |
W/o Emulsion, Foam, And Functional Foam App 20130216814 - Hirao; Akira ;   et al. | 2013-08-22 |
Composite Sheet App 20130210301 - Hirao; Akira ;   et al. | 2013-08-15 |
Method Of Reusably Separating Two Adhered Plates And Apparatus Used For The Method App 20130025777 - FUJITA; Masato ;   et al. | 2013-01-31 |
Cross-linked Resin Foam And Process For Producing The Same App 20110275727 - Yamamoto; Takayuki ;   et al. | 2011-11-10 |
Ultraviolet-curable Pressure-sensitive Adhesive Composition, Ultraviolet-curable Pressure-sensitive Adhesive Sheet And Process For Producing The Same App 20110003135 - Hirao; Akira ;   et al. | 2011-01-06 |
Heat-expandable Removable Acrylic Pressure-sensitive Adhesive Tape Or Sheet App 20100215947 - Yamanaka; Eiji ;   et al. | 2010-08-26 |
Thermally-foamable Re-releasable Acrylic Pressure-sensitive Adhesive Tape Or Sheet App 20100075129 - Nagasaki; Kunio ;   et al. | 2010-03-25 |
Photocurable Acrylic Viscoelastic Material Composition, Acrylic Viscoelastic Material, Acrylic Viscoelastic Material Layer Tape Or Sheet And Proceed For Producing The Same App 20090186164 - HIRAO; Akira ;   et al. | 2009-07-23 |
Radio communication system Grant 6,640,100 - Kojima , et al. October 28, 2 | 2003-10-28 |
Internally meshing planetary gear structure and flexible meshing type gear meshing structure Grant 5,429,556 - Ishida , et al. July 4, 1 | 1995-07-04 |
Internally meshing planetary gear structure and flexible meshing type gear meshing structure Grant 5,388,483 - Ishida , et al. February 14, 1 | 1995-02-14 |
Polymers of substituted 1,3-butadiene compounds having reactive silyl groups and process for their preparation Grant 4,730,031 - Sato , et al. March 8, 1 | 1988-03-08 |