| Patent | Date |
|---|
Solder preform and a process for its manufacture
Grant 10,081,852 - Hirano , et al. September 25, 2 | 2018-09-25 |
Semiconductor device
Grant 10,002,841 - Miyawaki , et al. June 19, 2 | 2018-06-19 |
Semiconductor Device
App 20170256510 - MIYAWAKI; Shotaro ; et al. | 2017-09-07 |
Silicon carbide semiconductor substrate and method for manufacturing same
Grant 9,269,576 - Yamauchi , et al. February 23, 2 | 2016-02-23 |
Silicon Carbide Semiconductor Substrate And Method For Manufacturing Same
App 20150228482 - Yamauchi; Shouichi ; et al. | 2015-08-13 |
Solder preform and a process for its manufacture
App 20110068149 - Hirano; Naohiko ; et al. | 2011-03-24 |
Solder preform and electronic component
Grant 7,800,230 - Hirano , et al. September 21, 2 | 2010-09-21 |
Solder preform and a process for its manufacture
Grant 7,793,820 - Hirano , et al. September 14, 2 | 2010-09-14 |
Solder Preform and Electronic Component
App 20090236725 - Hirano; Naohiko ; et al. | 2009-09-24 |
Method for manufacturing mold type semiconductor device
Grant 7,468,318 - Hirano , et al. December 23, 2 | 2008-12-23 |
Solder preform and a process for its manufacture
App 20080237301 - Hirano; Naohiko ; et al. | 2008-10-02 |
Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same
Grant 7,345,369 - Hirasawa , et al. March 18, 2 | 2008-03-18 |
Method for manufacturing mold type semiconductor device
App 20070158850 - Hirano; Naohiko ; et al. | 2007-07-12 |
Semiconductor device having heat radiation plate and bonding member
Grant 7,239,016 - Hirano , et al. July 3, 2 | 2007-07-03 |
Semiconductor device having metallic plate with groove
Grant 7,235,876 - Okumura , et al. June 26, 2 | 2007-06-26 |
Mold type semiconductor device
Grant 7,193,326 - Hirano , et al. March 20, 2 | 2007-03-20 |
Semiconductor device having metallic plate with groove
App 20070057373 - Okumura; Tomomi ; et al. | 2007-03-15 |
Transfer-molded power device and method for manufacturing transfer-molded power device
Grant 7,145,254 - Hirano , et al. December 5, 2 | 2006-12-05 |
Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same
App 20060087043 - Hirasawa; Naoki ; et al. | 2006-04-27 |
Double-sided cooling type semiconductor module
Grant 7,019,395 - Hirano , et al. March 28, 2 | 2006-03-28 |
Method for manufacturing semiconductor device having controlled surface roughness
Grant 6,927,167 - Fukuda , et al. August 9, 2 | 2005-08-09 |
Semiconductor device
App 20050167802 - Hirano, Naohiko ; et al. | 2005-08-04 |
Method of manufacturing a semiconductor device including electrodes on main and reverse sides of a semiconductor chip
App 20050170555 - Hirano, Naohiko ; et al. | 2005-08-04 |
Molded semiconductor power device having heat sinks exposed on one surface
Grant 6,917,103 - Hirano , et al. July 12, 2 | 2005-07-12 |
Semiconductor device
App 20050121701 - Hirano, Naohiko ; et al. | 2005-06-09 |
Switching circuit
Grant 6,884,953 - Nii , et al. April 26, 2 | 2005-04-26 |
Semiconductor device having heat radiation plate and bonding member
App 20050077617 - Hirano, Naohiko ; et al. | 2005-04-14 |
Semiconductor device
App 20050073042 - Hirano, Naohiko ; et al. | 2005-04-07 |
Mold type semiconductor device and method for manufacturing the same
App 20040256730 - Hirano, Naohiko ; et al. | 2004-12-23 |
Semiconductor device having a protective film
Grant 6,803,667 - Okura , et al. October 12, 2 | 2004-10-12 |
Semiconductor device having controlled surface roughness and method for manufacturing the same
App 20040119088 - Fukuda, Yutaka ; et al. | 2004-06-24 |
Semiconductor power device
App 20030122232 - Hirano, Naohiko ; et al. | 2003-07-03 |
Semiconductor device
App 20030052400 - Okura, Yasushi ; et al. | 2003-03-20 |
Transfer-molded power device and method for manufacturing transfer-molded power device
App 20030022464 - Hirano, Naohiko ; et al. | 2003-01-30 |
Switching circuit
App 20030001438 - Nii, Yoshihide ; et al. | 2003-01-02 |
Flip-chip connecting type semiconductor device
Grant 5,814,891 - Hirano September 29, 1 | 1998-09-29 |
Flip chip mounting type semiconductor device
Grant 5,801,447 - Hirano , et al. September 1, 1 | 1998-09-01 |
Connecting electrode portion in semiconductor device
Grant 5,648,686 - Hirano , et al. July 15, 1 | 1997-07-15 |
Multilayer wiring structure for attaining high-speed signal propagation
Grant 5,633,479 - Hirano May 27, 1 | 1997-05-27 |
Flip-chip semiconductor devices having two encapsulants
Grant 5,629,566 - Doi , et al. May 13, 1 | 1997-05-13 |
Semiconductor apparatus capable of cooling a semiconductor element with radiation efficiency
Grant 5,567,983 - Hirano , et al. October 22, 1 | 1996-10-22 |
Semiconductor apparatus capable of cooling a semiconductor element with low radiation efficiency
Grant 5,548,161 - Hirano , et al. August 20, 1 | 1996-08-20 |
Semiconductor device and method of manufacturing the same
Grant 5,530,289 - Hirano , et al. June 25, 1 | 1996-06-25 |
Semiconductor device of multichip module-type
Grant 5,401,688 - Yamaji , et al. March 28, 1 | 1995-03-28 |
Multilayer package
Grant 5,309,024 - Hirano May 3, 1 | 1994-05-03 |
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