Hirano; Minoru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hirano; Minoru.The latest application filed is for "needle adapter and device for soft material extrusion of core-shell structures".
- Hirano; Minoru - Cambridge MA
- HIRANO; Minoru - Yokohama JP
- HIRANO; Minoru - Nagakuta-shi JP
- HIRANO; Minoru - Nagakute-shi JP
- Hirano; Minoru - Kawasaki JP
- Hirano; Minoru - Okazaki JP
- Hirano, Minoru - Kyoto-shi JP
- Hirano, Minoru - Kawasaki-shi JP
- Hirano, Minoru - Okazaki-shi JP
- Hirano; Minoru - Kurume JP
| Patent | Date |
|---|---|
| Needle Adapter And Device For Soft Material Extrusion Of Core-shell Structures App 20210060328 - Nomura; Tsuyoshi ; et al. | 2021-03-04 |
| Information Processing Apparatus And Information Processing Method App 20200012325 - MATSUBARA; Masakazu ; et al. | 2020-01-09 |
| Bicompatible Liquid And Method For Screening Same App 20160313303 - HIRANO; Minoru ; et al. | 2016-10-27 |
| Use Of Ethanolamine Phosphate App 20150335665 - HIRANO; Minoru | 2015-11-26 |
| Use Of Ethanolamine Phosphate App 20150164762 - Hirano; Minoru | 2015-06-18 |
| Cooling unit Grant 7,828,047 - Miyazaki , et al. November 9, 2 | 2010-11-09 |
| Cooling unit App 20080236797 - Miyazaki; Ryuuji ; et al. | 2008-10-02 |
| Cooling unit Grant 7,337,829 - Miyazaki , et al. March 4, 2 | 2008-03-04 |
| Hydraulic bearing Grant 6,935,786 - Hirano , et al. August 30, 2 | 2005-08-30 |
| E-mail transmission control device and program thereof App 20050102363 - Yokomura, Makoto ; et al. | 2005-05-12 |
| IC card and IC card cooling tray Grant 6,781,846 - Suzuki , et al. August 24, 2 | 2004-08-24 |
| Electronic apparatus having a heat dissipation member Grant 6,717,808 - Ueda , et al. April 6, 2 | 2004-04-06 |
| Cooling unit App 20030188858 - Miyazaki, Ryuuji ; et al. | 2003-10-09 |
| Hydraulic bearing App 20030123765 - Hirano, Minoru ; et al. | 2003-07-03 |
| Cooling unit Grant 6,564,861 - Miyazaki , et al. May 20, 2 | 2003-05-20 |
| Electronic apparatus having a heat dissipation member Grant 6,507,493 - Ueda , et al. January 14, 2 | 2003-01-14 |
| Electronic apparatus having a heat dissipation member Grant 6,469,892 - Ueda , et al. October 22, 2 | 2002-10-22 |
| Cooling system for multichip module App 20020134532 - Hirano, Minoru ; et al. | 2002-09-26 |
| Electronic apparatus having a heat dissipation member Grant 6,385,043 - Ueda , et al. May 7, 2 | 2002-05-07 |
| Cooling System For Multichip Module App 20020005272 - HIRANO, MINORU ; et al. | 2002-01-17 |
| Electronic apparatus having a heat dissipation member App 20010050840 - Ueda, Akira ; et al. | 2001-12-13 |
| Electronic apparatus having a heat dissipation member App 20010017762 - Ueda, Akira ; et al. | 2001-08-30 |
| Electronic apparatus having a heat dissipation member App 20010010623 - Ueda, Akira ; et al. | 2001-08-02 |
| Electronic apparatus having a heat dissipation member Grant 6,226,180 - Ueda , et al. May 1, 2 | 2001-05-01 |
| Cooling system for multichip module Grant 6,219,236 - Hirano , et al. April 17, 2 | 2001-04-17 |
| IC card and IC card cooling tray Grant 6,031,718 - Suzuki , et al. February 29, 2 | 2000-02-29 |
| Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure Grant 5,894,882 - Kikuchi , et al. April 20, 1 | 1999-04-20 |
| Semiconductor element cooling apparatus Grant 5,763,950 - Fujisaki , et al. June 9, 1 | 1998-06-09 |
| Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together Grant 5,586,006 - Seyama , et al. December 17, 1 | 1996-12-17 |
| Fibrous bone filler and process of producing the same Grant 4,904,257 - Mori , et al. February 27, 1 | 1990-02-27 |
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