loadpatents
name:-0.019575119018555
name:-0.018871068954468
name:-0.0005650520324707
HIRANO; Masato Patent Filings

HIRANO; Masato

Patent Applications and Registrations

Patent applications and USPTO patent grants for HIRANO; Masato.The latest application filed is for "information processing device, information processing method, and program".

Company Profile
0.15.15
  • HIRANO; Masato - Tokyo JP
  • Hirano; Masato - Osaka N/A JP
  • Hirano; Masato - Toyonaka JP
  • Hirano, Masato - Toyonaka-shi JP
  • Hirano, Masato - Hiratsuka JP
  • Hirano; Masato - Kanagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Information Processing Device, Information Processing Method, And Program
App 20220189443 - NISHIOKA; Hayato ;   et al.
2022-06-16
Drum unit, image forming unit and image forming apparatus
Grant 9,933,739 - Hirano April 3, 2
2018-04-03
Drum Unit, Image Forming Unit And Image Forming Apparatus
App 20170343945 - Hirano; Masato
2017-11-30
Method and device for mounting electronic component
Grant RE44,384 - Hirano , et al. July 23, 2
2013-07-23
Circuit board and method for mounting chip component
Grant 7,667,299 - Mori , et al. February 23, 2
2010-02-23
Method for recycling wastes of an electrical appliance
Grant 7,540,078 - Suetsugu , et al. June 2, 2
2009-06-02
Soldering method, component to be joined by the soldering method, and joining structure
Grant 7,473,476 - Yamaguchi , et al. January 6, 2
2009-01-06
Semiconductor memory module having built-in antenna
Grant 7,471,260 - Ochi , et al. December 30, 2
2008-12-30
Article Having A Circuit Soldered With Parts And Method For Recycling Wastes Of The Same
App 20080210604 - Suetsugu; Kenichiro ;   et al.
2008-09-04
Semiconductor Memory Module Having Built-In Antenna
App 20080111756 - Ochi; Shozo ;   et al.
2008-05-15
Electronic component mounting method, and circuit substrate and circuit substrate unit used in the method
App 20070164079 - Mori; Masato ;   et al.
2007-07-19
Process and apparatus for flow soldering
Grant 7,150,387 - Yamaguchi , et al. December 19, 2
2006-12-19
Process for soldering and connecting structure
Grant 6,871,775 - Yamaguchi , et al. March 29, 2
2005-03-29
Soldering method, component to be joined by the soldering method, and joining structure
App 20040155336 - Yamaguchi, Atsushi ;   et al.
2004-08-12
Soldering method and method for manufacturing component mounting board
App 20040155097 - Yamaguchi, Atsushi ;   et al.
2004-08-12
Method of soldering lead-free solder, and joined object soldered by the soldering method
App 20040144829 - Matsushige, Kazumi ;   et al.
2004-07-29
Process and apparatus for flow soldering
App 20040056067 - Yamaguchi, Atsushi ;   et al.
2004-03-25
Method and device for mounting electronic component
Grant 6,708,402 - Hirano , et al. March 23, 2
2004-03-23
Method of soldering using lead-free solder and bonded article prepared through soldering by the method
Grant 6,702,175 - Matsushige , et al. March 9, 2
2004-03-09
Process and apparatus for flow soldering
Grant 6,648,216 - Yamaguchi , et al. November 18, 2
2003-11-18
Process for soldering and connecting structure
App 20030121959 - Yamaguchi, Atsushi ;   et al.
2003-07-03
Controlling method of storage apparatus, and storage apparatus, disk array device, and disk controller used in the method thereof
App 20030120862 - Hirano, Masato ;   et al.
2003-06-26
Solder material and electric or electronic device in which the same is used
App 20030015575 - Yamaguchi, Atsushi ;   et al.
2003-01-23
Process and apparatus for flow soldering
App 20020038815 - Yamaguchi, Atsushi ;   et al.
2002-04-04
Method and device for mounting electronic component
App 20010010120 - Hirano, Masato ;   et al.
2001-08-02
Method and device for mounting electronic component
App 20010010498 - Hirano, Masato ;   et al.
2001-08-02
Method and apparatus for mounting electronic component
Grant 5,868,302 - Onishi , et al. February 9, 1
1999-02-09
Method of mounting electronics component
Grant 5,743,007 - Onishi , et al. April 28, 1
1998-04-28
Method for forming a high contrast negative image
Grant 4,965,169 - Hirano , et al. October 23, 1
1990-10-23

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