| Patent | Date |
|---|
Information Processing Device, Information Processing System, And Method Of Information Processing
App 20220101209 - Okabe; Kotaro ; et al. | 2022-03-31 |
Information Processing Device, Guidance System, And Guidance Method
App 20220101353 - Okabe; Kotaro ; et al. | 2022-03-31 |
Control Device, System, Program, Terminal Device, And Service Support Method
App 20220076360 - Okabe; Kotaro ; et al. | 2022-03-10 |
Control Device, System, Vehicle, And Service Support Method
App 20220076179 - Okabe; Kotaro ; et al. | 2022-03-10 |
Prospective Client Intake And Assignment System
App 20220012749 - Apfelbaum; Yehuda ; et al. | 2022-01-13 |
Solar Cell And Method Of Manufacturing Solar Cell
App 20200098939 - NAKAI; Izuru ; et al. | 2020-03-26 |
Tactile sensor that includes two sheets each having at least either flexibility or elasticity
Grant 10,365,172 - Tomita , et al. July 30, 2 | 2019-07-30 |
Method Of Manufacturing Solar Cell, And Solar Cell
App 20190207052 - MASUKO; Keiichiro ; et al. | 2019-07-04 |
Flexible touch sensor and method of manufacturing the same
Grant 10,228,806 - Tomita , et al. | 2019-03-12 |
Tactile Sensor That Includes Two Sheets Each Having At Least Either Flexibility Or Elasticity
App 20180356301 - TOMITA; YOSHIHIRO ; et al. | 2018-12-13 |
Biological Sensor For Obtaining Information On Living Body
App 20180338719 - TOMITA; YOSHIHIRO ; et al. | 2018-11-29 |
Flexible substrate including stretchable sheet
Grant 9,844,133 - Tomita , et al. December 12, 2 | 2017-12-12 |
Flexible Touch Sensor And Method Of Manufacturing The Same
App 20170300147 - TOMITA; Yoshihiro ; et al. | 2017-10-19 |
Manufacturing method for electronic device
Grant 9,713,268 - Hirano July 18, 2 | 2017-07-18 |
Flexible Substrate Including Stretchable Sheet
App 20170181277 - TOMITA; YOSHIHIRO ; et al. | 2017-06-22 |
Substrate Including Stretchable Sheet
App 20170181276 - SAWADA; SUSUMU ; et al. | 2017-06-22 |
Electrochemical detector and method for producing same
Grant 9,541,518 - Yamashita , et al. January 10, 2 | 2017-01-10 |
Method for presenting tactile sensation and device therefor
Grant 9,383,822 - Wakuda , et al. July 5, 2 | 2016-07-05 |
Method for presenting tactile sensation and device therefor
Grant 9,383,821 - Wakuda , et al. July 5, 2 | 2016-07-05 |
Touch panel device with tactile sense presenting function
Grant 9,176,586 - Ogura , et al. November 3, 2 | 2015-11-03 |
Tactile sense presentation device and tactile sense presentation method
Grant 9,176,587 - Suzuki , et al. November 3, 2 | 2015-11-03 |
Display device and method for manufacturing the same
Grant 9,165,482 - Suzuki , et al. October 20, 2 | 2015-10-20 |
Manufacturing Method For Electronic Device
App 20150208513 - HIRANO; KOICHI | 2015-07-23 |
Flexible semiconductor device, method for manufacturing the same, image display device using the same and method for manufacturing the image display device
Grant 8,993,387 - Suzuki , et al. March 31, 2 | 2015-03-31 |
Flexible Semiconductor Device, Method For Manufacturing The Same, And Display Device
App 20150069403 - SUZUKI; TAKESHI ; et al. | 2015-03-12 |
Display Device And Method For Manufacturing The Same
App 20150069904 - SUZUKI; TAKESHI ; et al. | 2015-03-12 |
Flexible semiconductor device
Grant 8,975,626 - Suzuki , et al. March 10, 2 | 2015-03-10 |
Method for manufacturing flexible semiconductor device having gate electrode disposed within an opening of a resin film
Grant 8,895,373 - Suzuki , et al. November 25, 2 | 2014-11-25 |
Method For Presenting Tactile Sensation And Device Therefor
App 20140340210 - Wakuda; Daisuke ; et al. | 2014-11-20 |
Field-effect transistor and method for manufacturing the same
Grant 8,871,567 - Hirano , et al. October 28, 2 | 2014-10-28 |
Flexible semiconductor device, method for manufacturing the same, image display device using the same and method for manufacturing the image display device
Grant 8,847,229 - Suzuki , et al. September 30, 2 | 2014-09-30 |
Method For Presenting Tactile Sensation And Device Therefor
App 20140266649 - Wakuda; Daisuke ; et al. | 2014-09-18 |
Tactile Sense Presentation Device And Tactile Sense Presentation Method
App 20140240110 - Suzuki; Takeshi ; et al. | 2014-08-28 |
Touch Panel Device With Tactile Sense Presenting Function
App 20140225848 - Ogura; Tetsuyoshi ; et al. | 2014-08-14 |
Method For Presenting Tactile Sensation And Device Therefor
App 20140192005 - Wakuda; Daisuke ; et al. | 2014-07-10 |
Electrochemical Detector And Method For Producing Same
App 20140151225 - Yamashita; Yoshihisa ; et al. | 2014-06-05 |
Flip-chip mounting resin composition and bump forming resin composition
Grant 8,709,293 - Kitae , et al. April 29, 2 | 2014-04-29 |
Flip-chip mounting method and bump formation method
Grant 8,691,683 - Hirano , et al. April 8, 2 | 2014-04-08 |
Method For Manufacturing Flexible Semiconductor Device Having Gate Electrode Disposed Within An Opening Of A Resin Film
App 20140038366 - SUZUKI; Takeshi ; et al. | 2014-02-06 |
Method for making a semiconductor device on a flexible substrate
Grant 08617943 - | 2013-12-31 |
Method for making a semiconductor device on a flexible substrate
Grant 8,617,943 - Ichiryu , et al. December 31, 2 | 2013-12-31 |
Electronic paper and method for producing same
Grant 8,593,720 - Hirano , et al. November 26, 2 | 2013-11-26 |
Flexible semiconductor device having gate electrode disposed within an opening of a resin film
Grant 8,581,247 - Suzuki , et al. November 12, 2 | 2013-11-12 |
Flexible semiconductor device and method for producing the same
Grant 8,525,178 - Ichiryu , et al. September 3, 2 | 2013-09-03 |
Flexible semiconductor device
Grant 8,525,172 - Hirano , et al. September 3, 2 | 2013-09-03 |
Flexible Semiconductor Device And Method For Manufacturing Same
App 20130168677 - HIRANO; Koichi ; et al. | 2013-07-04 |
Flexible Semiconductor Device, Method For Manufacturing The Same, Image Display Device Using The Same And Method For Manufacturing The Image Display Device
App 20130168681 - Suzuki; Takeshi ; et al. | 2013-07-04 |
Flexible Semiconductor Device, Method For Manufacturing The Same, Image Display Device Using The Same And Method For Manufacturing The Image Display Device
App 20130161628 - Suzuki; Takeshi ; et al. | 2013-06-27 |
Method for manufacturing flexible semiconductor device
Grant 8,435,842 - Hirano , et al. May 7, 2 | 2013-05-07 |
Field-effect Transistor And Method For Manufacturing The Same
App 20130032797 - Hirano; Koichi ; et al. | 2013-02-07 |
Manufacturing method of flexible semiconductor device
Grant 8,367,488 - Ichiryu , et al. February 5, 2 | 2013-02-05 |
Semiconductor device and manufacturing process thereof
Grant 8,344,264 - Kumano , et al. January 1, 2 | 2013-01-01 |
Flexible semiconductor device and method for manufacturing same
Grant 8,343,822 - Hirano , et al. January 1, 2 | 2013-01-01 |
Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip
Grant 8,324,623 - Hirano , et al. December 4, 2 | 2012-12-04 |
Flexible Semiconductor Device, Method For Manufacturing The Same And Image Display Device
App 20120286264 - Suzuki; Takeshi ; et al. | 2012-11-15 |
Flexible Semiconductor Device, Method For Manufacturing The Same And Image Display Device
App 20120280229 - Suzuki; Takeshi ; et al. | 2012-11-08 |
Flexible Semiconductor Device And Method For Producing The Same
App 20120181543 - Ichiryu; Takashi ; et al. | 2012-07-19 |
Electronic Paper And Method For Producing Same
App 20120113500 - Hirano; Koichi ; et al. | 2012-05-10 |
Flexible Semiconductor Device And Method For Manufacturing Same
App 20120001173 - Suzuki; Takeshi ; et al. | 2012-01-05 |
Circuit board, method for manufacturing the same, and semiconductor device
Grant 8,063,486 - Hirano , et al. November 22, 2 | 2011-11-22 |
Semiconductor Chip, Semiconductor Mounting Module, Mobile Communication Device, And Process For Producing Semiconductor Chip
App 20110180900 - HIRANO; Koichi ; et al. | 2011-07-28 |
Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same
Grant 7,981,528 - Nakatani , et al. July 19, 2 | 2011-07-19 |
Manufacturing method of flexible semiconductor device and flexible semiconductor device
Grant 7,977,741 - Hirano , et al. July 12, 2 | 2011-07-12 |
Flip-chip Mounting Method And Bump Formation Method
App 20110162578 - Hirano; Koichi ; et al. | 2011-07-07 |
Metal Particles-dispersed Composition And Flip Chip Mounting Process And Bump-forming Process Using The Same
App 20110133137 - Hirano; Koichi ; et al. | 2011-06-09 |
Manufacturing Method Of Flexible Semiconductor Device
App 20110121298 - Ichiryu; Takashi ; et al. | 2011-05-26 |
Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip
Grant 7,943,518 - Hirano , et al. May 17, 2 | 2011-05-17 |
Flip-chip mounting method and bump formation method
Grant 7,927,997 - Hirano , et al. April 19, 2 | 2011-04-19 |
Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same
Grant 7,910,403 - Hirano , et al. March 22, 2 | 2011-03-22 |
Manufacturing Method Of Flexible Semiconductor Device And Flexible Semiconductor Device
App 20110049598 - HIRANO; Koichi ; et al. | 2011-03-03 |
Flexible Semiconductor Device And Method For Manufacturing The Same
App 20110042677 - Suzuki; Takeshi ; et al. | 2011-02-24 |
Transfer material used for producing a wiring substrate
Grant 7,888,789 - Sugaya , et al. February 15, 2 | 2011-02-15 |
Manufacturing method of flexible semiconductor device and flexible semiconductor device
Grant 7,851,281 - Hirano , et al. December 14, 2 | 2010-12-14 |
Flexible Semiconductor Device And Method For Manufacturing Same
App 20100283054 - Hirano; Koichi ; et al. | 2010-11-11 |
Method For Fabricating Flexible Semiconductor Device And Layered Film Used Therefore
App 20100276691 - Ichiryu; Takashi ; et al. | 2010-11-04 |
Method For Manufacturing Flexible Semiconductor Device
App 20100261321 - Hirano; Koichi ; et al. | 2010-10-14 |
Wireless communication system and method
Grant 7,801,491 - Hatakeyama , et al. September 21, 2 | 2010-09-21 |
Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method
Grant 7,754,529 - Tomita , et al. July 13, 2 | 2010-07-13 |
Method for producing connection member
Grant 7,748,110 - Asahi , et al. July 6, 2 | 2010-07-06 |
Semiconductor Chip, Semiconductor Mounting Module, Mobile Communication Device, And Process For Producing Semiconductor Chip
App 20100164061 - Hirano; Koichi ; et al. | 2010-07-01 |
Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei
Grant 7,726,545 - Ichiryu , et al. June 1, 2 | 2010-06-01 |
Manufacturing Method Of Flexible Semiconductor Device And Flexible Semiconductor Device
App 20100012936 - Hirano; Koichi ; et al. | 2010-01-21 |
Ball-point pen
Grant 7,641,412 - Hirano January 5, 2 | 2010-01-05 |
Semiconductor Device And Manufacturing Process Thereof
App 20090321124 - KUMANO; Yutaka ; et al. | 2009-12-31 |
Flip Chip Mounting Body And Method For Mounting Such Flip Chip Mounting Body And Bump Forming Method
App 20090203169 - Tomita; Yoshihiro ; et al. | 2009-08-13 |
Flip-chip Mounting Body And Flip-chip Mounting Method
App 20090085227 - Shiraishi; Tsukasa ; et al. | 2009-04-02 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
Grant 7,400,512 - Hirano , et al. July 15, 2 | 2008-07-15 |
Flip Clip Mounting Process And Bump-Forming Process Using Electrically-Conductive Particles
App 20080165518 - Ichiryu; Takashi ; et al. | 2008-07-10 |
Electronic component built-in module and method of manufacturing the same
Grant 7,394,663 - Yamashita , et al. July 1, 2 | 2008-07-01 |
Metal Particles-Dispersed Composition and Flip Chip Mounting Process and Bump-Forming Process Using the Same
App 20080142966 - Hirano; Koichi ; et al. | 2008-06-19 |
Flip-Chip Mounting Resin Composition and Bump Forming Resin Composition
App 20080128664 - Kitae; Takashi ; et al. | 2008-06-05 |
Module Incorporating A Capacitor, Method For Manufacturing The Same, And Capacitor Used Therefor
App 20080089043 - HIRANO; Koichi ; et al. | 2008-04-17 |
Magnetic Sheet With Stripe-arranged Magnetic Grains, Rfid Magnetic Sheet, Magnetic Shielding Sheet And Method Of Manufacturing The Same
App 20080070003 - NAKATANI; Seiichi ; et al. | 2008-03-20 |
Connection member and mount assembly and production method of the same
App 20080047137 - Asahi; Toshiyuki ; et al. | 2008-02-28 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
Grant 7,319,599 - Hirano , et al. January 15, 2 | 2008-01-15 |
Wireless communication system and wireless communication method
App 20070290805 - Hatakeyama; Shigeru ; et al. | 2007-12-20 |
Circuit Board, Method For Manufacturing The Same, And Semiconductor Device
App 20070262447 - HIRANO; Koichi ; et al. | 2007-11-15 |
Flip-Chip Mounting Method and Bump Formation Method
App 20070243664 - Hirano; Koichi ; et al. | 2007-10-18 |
Connection member and mount assembly and production method of the same
Grant 7,258,549 - Asahi , et al. August 21, 2 | 2007-08-21 |
Ball-point pen
App 20070183837 - Hirano; Koichi | 2007-08-09 |
Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same
Grant 7,247,178 - Hirano , et al. July 24, 2 | 2007-07-24 |
Wireless communication system and method
App 20070069022 - Hatakeyama; Shigeru ; et al. | 2007-03-29 |
Wireless communication system and method
App 20070063908 - Hatakeyama; Shigeru ; et al. | 2007-03-22 |
Wireless communication system and method
App 20070063907 - Hatakeyama; Shigeru ; et al. | 2007-03-22 |
Wireless communication system
App 20070066257 - Hatakeyama; Shigeru ; et al. | 2007-03-22 |
Module with built-in circuit elements
App 20070035013 - Handa; Hiroyuki ; et al. | 2007-02-15 |
Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same
App 20070022590 - Hirano; Koichi ; et al. | 2007-02-01 |
Semiconductor device and method for manufacturing the same
Grant 7,157,789 - Hirano , et al. January 2, 2 | 2007-01-02 |
Method of producing circuit component built-in module with embedded circuit component
Grant 7,140,104 - Hirano , et al. November 28, 2 | 2006-11-28 |
Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same
Grant 7,126,811 - Hirano , et al. October 24, 2 | 2006-10-24 |
Lead frame and production process thereof and production process of thermally conductive substrate
Grant 7,087,467 - Yamashita , et al. August 8, 2 | 2006-08-08 |
Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink
Grant 7,059,042 - Hirano , et al. June 13, 2 | 2006-06-13 |
Power module and method of manufacturing the same
Grant 7,041,535 - Yamashita , et al. May 9, 2 | 2006-05-09 |
Power module with improved heat dissipation
Grant 7,038,310 - Nakatani , et al. May 2, 2 | 2006-05-02 |
Semiconductor device and method for producing the same
App 20060087020 - Hirano; Koichi ; et al. | 2006-04-27 |
Thermally conductive substrate, thermally conductive substrate manufacturing method and power module
Grant 7,033,865 - Yamashita , et al. April 25, 2 | 2006-04-25 |
Method for manufacturing circuit board and circuit board and power conversion module using the same
Grant 7,022,276 - Hirano , et al. April 4, 2 | 2006-04-04 |
Method for producing a capacitor-embedded circuit board
Grant 7,013,561 - Nakatani , et al. March 21, 2 | 2006-03-21 |
Semiconductor device and method for manufacturing the same
App 20050263860 - Hirano, Koichi ; et al. | 2005-12-01 |
Thermal conductive substrate and semiconductor module using the same
Grant 6,958,535 - Hirano , et al. October 25, 2 | 2005-10-25 |
Wiring substrate produced by transfer material method
Grant 6,936,774 - Sugaya , et al. August 30, 2 | 2005-08-30 |
Connection member and mount assembly and production method of the same
App 20050184381 - Asahi, Toshiyuki ; et al. | 2005-08-25 |
Wiring substrate produced by transfer material method
App 20050186768 - Sugaya, Yasuhiro ; et al. | 2005-08-25 |
Circuit component built-in module, radio device having the same, and method for producing the same
Grant 6,931,725 - Sugaya , et al. August 23, 2 | 2005-08-23 |
Thermal conductive board, method of manufacturing the same, and power module with the same incorporated therein
App 20050158916 - Hirano, Koichi ; et al. | 2005-07-21 |
Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
App 20050073818 - Hirano, Koichi ; et al. | 2005-04-07 |
Transfer material for wiring substrate
Grant 6,871,396 - Sugaya , et al. March 29, 2 | 2005-03-29 |
Lead frame and production process thereof and production process of thermally conductive substrate
Grant 6,870,244 - Yamashita , et al. March 22, 2 | 2005-03-22 |
Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink
Grant 6,860,004 - Hirano , et al. March 1, 2 | 2005-03-01 |
Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production
App 20050005420 - Hirano, Koichi ; et al. | 2005-01-13 |
Thermally conductive substrate, thermally conductive substrate manufacturing method and power module
App 20040207053 - Yamashita, Yoshihisa ; et al. | 2004-10-21 |
Circuit board and production method therefor
Grant 6,791,034 - Suzumura , et al. September 14, 2 | 2004-09-14 |
Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production
Grant 6,787,884 - Hirano , et al. September 7, 2 | 2004-09-07 |
Electronic component built-in module and method of manufacturing the same
App 20040160752 - Yamashita, Yoshihisa ; et al. | 2004-08-19 |
Power module and method of manufacturing the same
App 20040145046 - Yamashita, Yoshihisa ; et al. | 2004-07-29 |
Lead frame and production process thereof and production process of thermally conductive substrate
App 20040142511 - Yamashita, Yoshihisa ; et al. | 2004-07-22 |
Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same
App 20040125543 - Hirano, Koichi ; et al. | 2004-07-01 |
Power module and method of manufacturing the same
Grant 6,707,671 - Yamashita , et al. March 16, 2 | 2004-03-16 |
Thermally conductive substrate, thermally conductive substrate manufacturing method and power module
Grant 6,700,182 - Yamashita , et al. March 2, 2 | 2004-03-02 |
Method for manufacturing circuit board and circuit board and power conversion module using the same
Grant 6,692,818 - Hirano , et al. February 17, 2 | 2004-02-17 |
Composition for substrate materials and process for the same as well as a heat conductive substrate and process for the same
Grant 6,666,392 - Hirano , et al. December 23, 2 | 2003-12-23 |
Method for manufacturing circuit board and circuit board and power conversion module using the same
App 20030230813 - Hirano, Koichi ; et al. | 2003-12-18 |
Circuit component, circuit component package,, circuit component built-in module, circuit component package production and circuit component built-in module production
App 20030222335 - Hirano, Koichi ; et al. | 2003-12-04 |
Composition for substrate materials and process for the same as well as a heat conductive substrate and process for the same
App 20030155455 - Hirano, Koichi ; et al. | 2003-08-21 |
Thermal conductive substrate and the method for manufacturing the same
App 20030148079 - Hirano, Koichi ; et al. | 2003-08-07 |
Circuit component built-in module, radio device having the same, and method for producing the same
App 20030141105 - Sugaya, Yasuhiro ; et al. | 2003-07-31 |
Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
App 20030116348 - Nakatani, Seiichi ; et al. | 2003-06-26 |
Transfer material method for producing the same and wiring substrate produced by using the same
App 20030102153 - Sugaya, Yasuhiro ; et al. | 2003-06-05 |
Thermal conductive substrate and the method for manufacturing the same
Grant 6,570,099 - Hirano , et al. May 27, 2 | 2003-05-27 |
Thermal conductive board, method of manufacturing the same, and power module with the same incorporated therein
App 20030076663 - Hirano, Koichi ; et al. | 2003-04-24 |
Circuit board and production method therefor
App 20030072136 - Suzumura, Masaki ; et al. | 2003-04-17 |
Circuit component built-in module, radio device having the same, and method for producing the same
Grant 6,538,210 - Sugaya , et al. March 25, 2 | 2003-03-25 |
Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
Grant 6,525,921 - Nakatani , et al. February 25, 2 | 2003-02-25 |
Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein
Grant 6,522,555 - Hirano , et al. February 18, 2 | 2003-02-18 |
Method for manufacturing circuit board and circuit board and power conversion module using the same
App 20020187321 - Hirano, Koichi ; et al. | 2002-12-12 |
Lead frame and production process thereof and production process of thermally conductive substrate
App 20020187318 - Yamashita, Yoshihisa ; et al. | 2002-12-12 |
Power module and method of manufacturing the same
App 20020179289 - Yamashita, Yoshihisa ; et al. | 2002-12-05 |
Thermal conductive substrate and semiconductor module using the same
App 20020096759 - Hirano, Koichi ; et al. | 2002-07-25 |
Magnetic element and method of manufacturing the same
Grant 6,392,525 - Kato , et al. May 21, 2 | 2002-05-21 |
Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection
App 20020028536 - Hirano, Koichi ; et al. | 2002-03-07 |
Thermally conductive substrate, thermally conductive substrate manufacturing method and power module
App 20020020897 - Yamashita, Yoshihisa ; et al. | 2002-02-21 |
Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein
App 20010036065 - Hirano, Koichi ; et al. | 2001-11-01 |
Circuit component built-in module, radio device having the same, and method for producing the same
App 20010030059 - Sugaya, Yasuhiro ; et al. | 2001-10-18 |
Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection
Grant 6,300,686 - Hirano , et al. October 9, 2 | 2001-10-09 |
Composition for substrate materials and process for the same as well as a heat conductive substrate and process for the same
App 20010026863 - Hirano, Koichi ; et al. | 2001-10-04 |
Transfer material, method for producing the same and wiring substrate produced by using the same
App 20010023779 - Sugaya, Yasuhiro ; et al. | 2001-09-27 |
Process For Producing Self-inking Stamp And Self-inking Stamp
App 20010013293 - HIRANO, KOICHI | 2001-08-16 |
Power converting apparatus and method using a multiple three-phase PWM cycloconverter system
Grant 5,969,966 - Sawa , et al. October 19, 1 | 1999-10-19 |
Method for making a ring-shaped mold
Grant 4,411,175 - Takahashi , et al. October 25, 1 | 1983-10-25 |
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