Hiramatsu; Toshio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hiramatsu; Toshio.The latest application filed is for "method for fabricating group iii nitride compound semiconductors and group iii nitride compound semiconductor devices".

Company Profile

0.11.10

Hiramatsu; Toshio - Aichi JP
Hiramatsu; Toshio - Otsu JP
Hiramatsu; Toshio - Aichi-ken JP
Hiramatsu, Toshio - Nishikasugai-gun JP
Hiramatsu; Toshio - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for fabricating group III nitride compound semiconductors and group III nitride compound semiconductor devices Grant 7,560,725 - Koike , et al. July 14, 2	2009-07-14
Method for fabricating group III nitride compound semiconductors and group III nitride compound semiconductor devices Grant 7,491,984 - Koike , et al. February 17, 2	2009-02-17
Production method of III nitride compound semiconductor and III nitride compound semiconductor element Grant 7,141,444 - Koike , et al. November 28, 2	2006-11-28
Production method for semiconductor crystal and semiconductor luminous element Grant 7,052,979 - Nagai , et al. May 30, 2	2006-05-30
Method for fabricating Group III nitride compound semiconductors and Group III nitride compound semiconductor devices App 20060027831 - Kioke; Masayoshi ; et al.	2006-02-09
Method for producing group III nitride compound semiconductor and group III nitride compound semiconductor device Grant 6,979,584 - Koike , et al. December 27, 2	2005-12-27
Method for fabricating group III nitride compound semiconductors and group III nitride compound semiconductor devices App 20050093099 - Koike, Masayoshi ; et al.	2005-05-05
Methods for fabricating group III nitride compound semiconductors and group III nitride compound semiconductor devices Grant 6,861,305 - Koike , et al. March 1, 2	2005-03-01
Inorganic reinforced polyamide resin compositions Grant 6,835,787 - Tamura , et al. December 28, 2	2004-12-28
Inorganic reinforced polyamide resin compositions Grant 6,835,771 - Tamura , et al. December 28, 2	2004-12-28
Method for producing group III nitride compound semiconductor and group III nitride compound semiconductor device Grant 6,830,948 - Koike , et al. December 14, 2	2004-12-14
Production method for semiconductor crystal and semiconductor luminous element App 20040123796 - Nagai, Seiji ; et al.	2004-07-01
Group III nitride compound semiconductor laser Grant 6,680,957 - Koike , et al. January 20, 2	2004-01-20
Production method of III nitride compound semiconductor and III nitride compound semiconductor element App 20030134446 - Koike, Masayoshi ; et al.	2003-07-17
Inorganic reinforced polyamide resin compositions App 20030125440 - Tamura, Tutomu ; et al.	2003-07-03
Inorganic reinforced polyamide resin compositions App 20030125481 - Tamura, Tutomu ; et al.	2003-07-03
Production method of III nitride compound semiconductor and III nitride compound semiconductor element App 20030119239 - Koike, Masayoshi ; et al.	2003-06-26
Method for producing group III nitride compound semiconductor and group III nitride compound semiconductor device App 20030092263 - Koike, Masayoshi ; et al.	2003-05-15
Method for producing group III nitride compound semiconductor and group III nitride compound semiconductor device App 20030092230 - Koike, Masayoshi ; et al.	2003-05-15
Light-emitting device using group III nitride group compound semiconductor App 20010013605 - Umezaki, Tamiyo ; et al.	2001-08-16
Method of sealing water leakage in concrete structures Grant 4,744,193 - Hatsuzaki , et al. May 17, 1	1988-05-17

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