loadpatents
Patent applications and USPTO patent grants for HIRAMATSU; Seiki.The latest application filed is for "semiconductor device, method for manufacturing semiconductor device, and power conversion device".
Patent | Date |
---|---|
Semiconductor Device, Method For Manufacturing Semiconductor Device, And Power Conversion Device App 20210391299 - KAJI; Yusuke ;   et al. | 2021-12-16 |
Power Semiconductor Module And Power Conversion Apparatus App 20210082778 - KAJI; Yusuke ;   et al. | 2021-03-18 |
Semiconductor Device And Power Converter App 20200335411 - ROKUBUICHI; Hodaka ;   et al. | 2020-10-22 |
Semiconductor device with an insulating terminal table Grant 9,153,512 - Terai , et al. October 6, 2 | 2015-10-06 |
Semiconductor device and method for manufacturing semiconductor device Grant 9,082,707 - Hiramatsu , et al. July 14, 2 | 2015-07-14 |
Thermosetting resin composition, B-stage heat conductive sheet, and power module Grant 9,029,438 - Yamamoto , et al. May 12, 2 | 2015-05-12 |
Semiconductor Device App 20130306991 - Terai; Mamoru ;   et al. | 2013-11-21 |
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20130240909 - Hiramatsu; Seiki ;   et al. | 2013-09-19 |
Thermosetting Resin Composition, B-stage Heat Conductive Sheet, And Power Module App 20130012621 - Yamamoto; Kei ;   et al. | 2013-01-10 |
Semiconductor device and process for producing same Grant 8,236,666 - Hiramatsu , et al. August 7, 2 | 2012-08-07 |
Organopolysiloxane composition and semiconductor apparatus Grant 8,222,752 - Hiramatsu July 17, 2 | 2012-07-17 |
Heat conductive sheet and method for producing same, and powder module Grant 8,193,633 - Mimura , et al. June 5, 2 | 2012-06-05 |
Organopolysiloxane Composition And Semiconductor Apparatus App 20120032189 - HIRAMATSU; Seiki | 2012-02-09 |
Heat Conductive Sheet And Power Module App 20100226095 - Mimura; Kenji ;   et al. | 2010-09-09 |
Semiconductor Device And Process For Producing Same App 20100201002 - Hiramatsu; Seiki ;   et al. | 2010-08-12 |
Semiconductor device Grant 7,514,782 - Hiramatsu , et al. April 7, 2 | 2009-04-07 |
Photoelectric composite connector and substrate using the same Grant 7,488,119 - Yoshida , et al. February 10, 2 | 2009-02-10 |
Semiconductor Device App 20070241450 - Hiramatsu; Seiki ;   et al. | 2007-10-18 |
Photoelectric composite connector and substrate using the same App 20070122088 - Yoshida; Takumi ;   et al. | 2007-05-31 |
Optical path-changing connector Grant 6,934,450 - Hiramatsu August 23, 2 | 2005-08-23 |
Optical path changing device Grant 6,907,173 - Hiramatsu June 14, 2 | 2005-06-14 |
Optical path-changing connector App 20040114866 - Hiramatsu, Seiki | 2004-06-17 |
Semiconductor device Grant 6,700,073 - Hiramatsu , et al. March 2, 2 | 2004-03-02 |
Optical path changing device and method for the manufacture thereof App 20030198439 - Hiramatsu, Seiki | 2003-10-23 |
Semiconductor device App 20020070439 - Hiramatsu, Seiki ;   et al. | 2002-06-13 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.