HIRAMATSU; Ryo

Patent Applications and Registrations

Patent applications and USPTO patent grants for HIRAMATSU; Ryo.The latest application filed is for "electrical overlay measurement methods and structures for wafer-to-wafer bonding".

Company Profile

4.5.9

HIRAMATSU; Ryo - Yokkaichi JP
Hiramatsu; Ryo - Makinohara-shi JP
Hiramatsu; Ryo - Makinohara JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrical Overlay Measurement Methods And Structures For Wafer-to-wafer Bonding App 20220285234 - YOKOMIZO; Ikue ; et al.	2022-09-08
Connecting Method And Electrical Component Unit App 20220126767 - Hiramatsu; Ryo	2022-04-28
On-vehicle Control System And Controlling Method Of On-vehicle Control System App 20210291852 - Hiramatsu; Ryo ; et al.	2021-09-23
Lighting control system and lighting control method Grant 11,057,978 - Hiramatsu July 6, 2	2021-07-06
Communication system, vehicle unit, and seat unit Grant 10,988,066 - Hiramatsu April 27, 2	2021-04-27
Audio control system and audio control method Grant 10,976,993 - Hiramatsu April 13, 2	2021-04-13
Audio Control System And Audio Control Method App 20200334002 - HIRAMATSU; Ryo	2020-10-22
Lighting Control System And Lighting Control Method App 20200337139 - HIRAMATSU; Ryo	2020-10-22
Communication System, Vehicle Unit, And Seat Unit App 20200331373 - Hiramatsu; Ryo	2020-10-22
Lighting Control System And Lighting Control Method App 20200324696 - HIRAMATSU; Ryo	2020-10-15
Air Conditioning Control System And Air Conditioning Control Method App 20200324614 - Hiramatsu; Ryo	2020-10-15
Bonded Assembly Containing Side Bonding Structures And Methods Of Manufacturing The Same App 20200321324 - Sano; Michiaki ; et al.	2020-10-08
Bonded assembly containing side bonding structures and methods of manufacturing the same Grant 10,797,035 - Sano , et al. October 6, 2	2020-10-06
Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer Grant 10,790,296 - Yamaha , et al. September 29, 2	2020-09-29

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