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Patent applications and USPTO patent grants for Hirakura; Hiroaki.The latest application filed is for "photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film".
Patent | Date |
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Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film Grant 7,071,243 - Sato , et al. July 4, 2 | 2006-07-04 |
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film App 20040214924 - Sato, Kuniaki ;   et al. | 2004-10-28 |
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film Grant 6,692,793 - Sato , et al. February 17, 2 | 2004-02-17 |
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film App 20010053437 - Sato, Kuniaki ;   et al. | 2001-12-20 |
Photo Curable Resin Composition And Photosensitive Element App 20010003759 - SATO, KUNIAKI ;   et al. | 2001-06-14 |
Photosensitive resin composition Grant 6,238,840 - Hirayama , et al. May 29, 2 | 2001-05-29 |
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