loadpatents
name:-0.0061721801757812
name:-0.055333137512207
name:-0.0034759044647217
Hirakawa; Tadashi Patent Filings

Hirakawa; Tadashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hirakawa; Tadashi.The latest application filed is for "vehicle body rear structure".

Company Profile
2.26.4
  • Hirakawa; Tadashi - Wako JP
  • HIRAKAWA; Tadashi - Wako-shi JP
  • Hirakawa; Tadashi - Osaka JP
  • Hirakawa; Tadashi - Osaka 564 JP
  • Hirakawa; Tadashi - Suita JP
  • Hirakawa; Tadashi - Kawasaki JP
  • Hirakawa; Tadashi - Mihara JP
  • Hirakawa; Tadashi - Hiroshima JP
  • Hirakawa; Tadashi - Ibaraki JP
  • Hirakawa; Tadashi - Kusatsu JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Vehicle body rear structure
Grant 11,161,549 - Sakai , et al. November 2, 2
2021-11-02
Vehicle body rear structure
Grant 11,097,679 - Sakai , et al. August 24, 2
2021-08-24
Vehicle Body Rear Structure
App 20200101914 - SAKAI; Kazuhiro ;   et al.
2020-04-02
Vehicle Body Rear Structure
App 20200102014 - SAKAI; Kazuhiro ;   et al.
2020-04-02
Door structure for vehicle
Grant 10,150,353 - Hirakawa , et al. Dec
2018-12-11
Door Structure For Vehicle
App 20170274744 - Hirakawa; Tadashi ;   et al.
2017-09-28
Side airbag apparatus
Grant 7,946,616 - Ochiai , et al. May 24, 2
2011-05-24
Side Airbag Apparatus
App 20100295277 - Ochiai; Fumiharu ;   et al.
2010-11-25
Printed circuit board with opposed bonding shelves for semiconductor chip wire bonding at different levels
Grant 6,040,984 - Hirakawa March 21, 2
2000-03-21
Ball grid array semiconductor package with solder ball openings in an insulative base
Grant 6,011,694 - Hirakawa January 4, 2
2000-01-04
Ball grid array semiconductor package
Grant 5,994,773 - Hirakawa November 30, 1
1999-11-30
Integrated circuit package with via interconnections formed in a substrate
Grant 5,483,100 - Marrs , et al. January 9, 1
1996-01-09
Method for forming an integrated circuit package with via interconnection
Grant 5,378,869 - Marrs , et al. January 3, 1
1995-01-03
Ball grid array with via interconnection
Grant 5,355,283 - Marrs , et al. October 11, 1
1994-10-11
Surface-modified wholly aromatic polyamide fiber and method of producing same
Grant 5,240,770 - Moriga , et al. August 31, 1
1993-08-31
Method for treating cancer therapy radiation damage or arteriosclerosis using human ADF
Grant 5,210,073 - Yodoi , et al. May 11, 1
1993-05-11
Conveyor system for planar objects
Grant 4,863,154 - Hirakawa , et al. September 5, 1
1989-09-05
Slitter scorer including a head exchanging device
Grant 4,846,778 - Hirakawa , et al. July 11, 1
1989-07-11
Base material for honeycomb core structure and process for producing the same
Grant 4,710,432 - Nishimura , et al. December 1, 1
1987-12-01
Intermittent feeding apparatus for a continuous sheet
Grant 4,706,863 - Hirakawa , et al. November 17, 1
1987-11-17
Sheet stacker
Grant 4,667,953 - Hirakawa , et al. May 26, 1
1987-05-26
Single facer
Grant 4,627,831 - Hirakawa , et al. December 9, 1
1986-12-09
Dust-proof fabric
Grant 4,582,747 - Hirakawa , et al. April 15, 1
1986-04-15
Synthetic polyester pulp and process for preparing same
Grant 4,529,481 - Yoshida , et al. July 16, 1
1985-07-16
Process for producing paper or non-woven fabric
Grant 4,501,641 - Hirakawa , et al. February 26, 1
1985-02-26
Paper-like polyester fiber sheet and process for producing the same
Grant 4,496,583 - Yamamoto , et al. January 29, 1
1985-01-29
Mill roll stand
Grant 4,460,135 - Hirakawa , et al. July 17, 1
1984-07-17
Raised and fused fabric filter and process for producing the same
Grant 4,225,642 - Hirakawa September 30, 1
1980-09-30
Antistatic composite yarn and carpet
Grant 4,154,881 - Hirakawa , et al. May 15, 1
1979-05-15
Apparatus for positioning heads
Grant 4,010,677 - Hirakawa , et al. March 8, 1
1977-03-08

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