Hirakawa; Naoya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hirakawa; Naoya.The latest application filed is for "substrate processing method and substrate processing system".
- Hirakawa; Naoya - Kumamoto JP
| Patent | Date |
|---|---|
| Reduced-pressure drying unit and coating film forming method Grant 7,534,467 - Kitano , et al. May 19, 2 | 2009-05-19 |
| Substrate processing method and substrate processing system Grant 7,179,504 - Kitano , et al. February 20, 2 | 2007-02-20 |
| Substrate processing method and substrate processing system App 20050100679 - Kitano, Takahiro ; et al. | 2005-05-12 |
| Reduced-pressure drying unit and coating film forming method App 20050087129 - Kitano, Takahiro ; et al. | 2005-04-28 |
| Substrate processing method and substrate processing system Grant 6,824,616 - Kitano , et al. November 30, 2 | 2004-11-30 |
| Reduced-pressure drying unit and coating film forming method Grant 6,808,566 - Kitano , et al. October 26, 2 | 2004-10-26 |
| Substrate processing unit Grant 6,773,510 - Kitano , et al. August 10, 2 | 2004-08-10 |
| Reduced-pressure drying unit and coating film forming method App 20030054668 - Kitano, Takahiro ; et al. | 2003-03-20 |
| Substrate processing unit App 20020148566 - Kitano, Takahiro ; et al. | 2002-10-17 |
| Substrate processing method and substrate processing system App 20020150691 - Kitano, Takahiro ; et al. | 2002-10-17 |
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