Hirakawa; Eiji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hirakawa; Eiji.The latest application filed is for "plasma processing apparatus for powder and plasma processing method for powder".
- Hirakawa; Eiji - Higashiizumo JP
- Hirakawa; Eiji - Yonago JP
- Hirakawa; Eiji - Shimane JP
| Patent | Date |
|---|---|
| Plasma processing apparatus for powder and plasma processing method for powder Grant 7,381,363 - Uesaka , et al. June 3, 2 | 2008-06-03 |
| Method of manufacturing a sintered body Grant 7,135,141 - Han , et al. November 14, 2 | 2006-11-14 |
| Plasma processing apparatus for powder and plasma processing method for powder App 20050183542 - Uesaka, Shujiroh ; et al. | 2005-08-25 |
| Method of manufacturing a sintered body App 20040191108 - Han, Gang ; et al. | 2004-09-30 |
| Low resistive tantalum thin film structure and method for forming the same Grant 6,110,598 - Maeda , et al. August 29, 2 | 2000-08-29 |
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