HIRAKAWA; Atsushi
Patent Applications and Registrations
Patent applications and USPTO patent grants for HIRAKAWA; Atsushi.The latest application filed is for "liquid crystal polyester composition and molded body".
- HIRAKAWA; Atsushi - Katsuragi-shi JP
- Hirakawa; Atsushi - Kanazawa JP
- Hirakawa; Atsushi - Shiga-ken JP
| Patent | Date |
|---|---|
| Liquid Crystal Polyester Composition And Molded Body App 20220275170 - HIRAKAWA; Atsushi | 2022-09-01 |
| Surface acoustic wave device having a package including a conductive cap that is coated with sealing material Grant 6,437,412 - Higuchi , et al. August 20, 2 | 2002-08-20 |
| Sealing structure and method of sealing electronic component Grant 5,886,457 - Maesaka , et al. March 23, 1 | 1999-03-23 |
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