Hiraiwa; Katsuro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hiraiwa; Katsuro.The latest application filed is for "semiconductor device having a heat spreader exposed from a seal resin".
- Hiraiwa; Katsuro - Kawasaki JP
- Hiraiwa; Katsuro - Kawasaki-shi JP
| Patent | Date |
|---|---|
| Camera module equipped with an optical filter having an edge not in contact with a fixing portion Grant 7,659,937 - Onodera , et al. February 9, 2 | 2010-02-09 |
| Semiconductor device having a heat spreader exposed from a seal resin App 20070114642 - Hosoyamada; Sumikazu ; et al. | 2007-05-24 |
| Semiconductor device having a heat spreader exposed from a seal resin Grant 7,193,320 - Hosoyamada , et al. March 20, 2 | 2007-03-20 |
| Camera module App 20060243884 - Onodera; Masanori ; et al. | 2006-11-02 |
| Semiconductor device having a heat spreader exposed from a seal resin App 20030222344 - Hosoyamada, Sumikazu ; et al. | 2003-12-04 |
| Semiconductor device and method for producing the same Grant 6,215,182 - Ozawa , et al. April 10, 2 | 2001-04-10 |
| Process for sealing a semiconductor device Grant 5,230,759 - Hiraiwa July 27, 1 | 1993-07-27 |
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