Hirai; Hitoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hirai; Hitoshi.The latest application filed is for "wedge clamp and steel wire".
- Hirai; Hitoshi - Tokyo JP
- HIRAI; Hitoshi - Nerima-ku Tokyo
- Hirai; Hitoshi - Kyoto JP
- HIRAI; Hitoshi - Kyoto-shi JP
| Patent | Date |
|---|---|
| Wedge clamp and steel wire Grant 11,261,937 - Urata , et al. March 1, 2 | 2022-03-01 |
| Wedge Clamp And Steel Wire App 20210293303 - URATA; Yousuke ; et al. | 2021-09-23 |
| Molded product, electrical product, and method for manufacturing molded product Grant 10,710,288 - Yamazaki , et al. | 2020-07-14 |
| Molded Product, Electrical Product, And Method For Manufacturing Molded Product App 20200101646 - YAMAZAKI; Seiichi ; et al. | 2020-04-02 |
| Analysis method and apparatus for sulfur component using ultraviolet fluorescence Grant 7,427,378 - Akashi , et al. September 23, 2 | 2008-09-23 |
| Gas sampling bag Grant 7,380,476 - Hirai , et al. June 3, 2 | 2008-06-03 |
| Analysis method and apparatus for sulfur component using ultraviolet fluorescence App 20050079625 - Akashi, Kotaro ; et al. | 2005-04-14 |
| Gas sampling bag App 20050056103 - Hirai, Hitoshi ; et al. | 2005-03-17 |
| End assembly for connection to end of ground wire with optical fiber Grant 4,674,832 - Hirai , et al. June 23, 1 | 1987-06-23 |
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