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Patent applications and USPTO patent grants for Hiraharu; Teruo.The latest application filed is for "low dielectric composition, insulating material, sealing material, and circuit board".
Patent | Date |
---|---|
Low dielectric composition, insulating material, sealing material, and circuit board Grant 6,146,749 - Miyamoto , et al. November 14, 2 | 2000-11-14 |
Water-based maskant composition and chemical milling method using the same Grant 5,466,739 - Maeda , et al. November 14, 1 | 1995-11-14 |
Aqueous fluorine-containing polymer dispersion and aqueous dispersion containing fluorine-containing polymer and water-soluble resin and/or water dispersible resin Grant 5,349,003 - Kato , et al. September 20, 1 | 1994-09-20 |
Polymer particles comprising ethylenically unsaturated monomers as main constituent and having localized thereon conjugated diolefin (co-)polymer layer Grant 4,331,784 - Ishibashi , et al. May 25, 1 | 1982-05-25 |
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