HIRAFUNE; Sayaka
Patent Applications and Registrations
Patent applications and USPTO patent grants for HIRAFUNE; Sayaka.The latest application filed is for "semiconductor package and manufacturing method for the same".
- HIRAFUNE; Sayaka - Sakura-shi JP
- Hirafune; Sayaka - Tokyo JP
- Hirafune; Sayaka - Toyko JP
| Patent | Date |
|---|---|
| Semiconductor Package And Manufacturing Method For The Same App 20100117220 - HIRAFUNE; Sayaka ; et al. | 2010-05-13 |
| Semiconductor package and method for manufacturing the same Grant 7,368,321 - Tomita , et al. May 6, 2 | 2008-05-06 |
| Semiconductor package and method for manufacturing the same App 20070264753 - Tomita; Michikazu ; et al. | 2007-11-15 |
| Semiconductor package and method for manufacturing the same Grant 7,274,101 - Tomita , et al. September 25, 2 | 2007-09-25 |
| Semiconductor package with through-hole Grant 7,180,149 - Yamamoto , et al. February 20, 2 | 2007-02-20 |
| Metal filling process and metal filling apparatus App 20060113057 - Hirafune; Sayaka ; et al. | 2006-06-01 |
| Semiconductor package and method for manufacturing the same App 20060001147 - Tomita; Michikazu ; et al. | 2006-01-05 |
| Semiconductor package and method of manufacturing same App 20050056903 - Yamamoto, Satoshi ; et al. | 2005-03-17 |
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