Hirabayashi; Keisuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hirabayashi; Keisuke.The latest application filed is for "method of processing dummy pattern based on boundary length and density of wiring pattern, semiconductor design apparatus and semiconductor device".

Company Profile

0.5.6

Hirabayashi; Keisuke - Kanagawa N/A JP
Hirabayashi; Keisuke - Toyohashi JP
Hirabayashi; Keisuke - Aichi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of processing dummy pattern based on boundary length and density of wiring pattern, semiconductor design apparatus and semiconductor device Grant 8,365,127 - Hirabayashi January 29, 2	2013-01-29
Method Of Processing Dummy Pattern Based On Boundary Length And Density Of Wiring Pattern, Semiconductor Design Apparatus And Semiconductor Device App 20120199979 - HIRABAYASHI; Keisuke	2012-08-09
Method of processing dummy pattern based on boundary length and density of wiring pattern, semiconductor design apparatus and semiconductor device Grant 8,181,142 - Hirabayashi May 15, 2	2012-05-15
Method of processing dummy pattern based on boundary length and density of wiring pattern, semiconductor design apparatus and semiconductor device Grant 7,900,177 - Hirabayashi March 1, 2	2011-03-01
Method of processing dummy pattern based on boundary length and density of wiring pattern, semiconductor design apparatus and semiconductor device App 20100327467 - Hirabayashi; Keisuke	2010-12-30
Method, device, and program for predicting a manufacturing defect part of a semiconductor device App 20100131915 - Hirabayashi; Keisuke	2010-05-27
Ultrasonic sensor comprising a metal/ferroelectric/metal/insulator/semiconductor structure Grant 7,692,257 - Ishida , et al. April 6, 2	2010-04-06
Integrated Device App 20090278212 - Ishida; Makoto ; et al.	2009-11-12
Method of processing dummy pattern based on boundary length and density of wiring pattern, semiconductor design apparatus and semiconductor device App 20080179754 - Hirabayashi; Keisuke	2008-07-31
Semiconductor element, semiconductor sensor and semiconductor memory element App 20060278907 - Ishida; Makoto ; et al.	2006-12-14

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