HINO; Yasunari

Patent Applications and Registrations

Patent applications and USPTO patent grants for HINO; Yasunari.The latest application filed is for "semiconductor device, power converter, method for manufacturing semiconductor device, and method for manufacturing power converter".

Company Profile

6.15.16

HINO; Yasunari - Tokyo JP
Hino; Yasunari - Chiyoda-ku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device, Power Converter, Method For Manufacturing Semiconductor Device, And Method For Manufacturing Power Converter App 20220028794 - HINO; Yasunari ; et al.	2022-01-27
Semiconductor device, power converter, method for manufacturing semiconductor device, and method for manufacturing power converter Grant 11,183,457 - Hino , et al. November 23, 2	2021-11-23
Silicon Carbide Epitaxial Growth Device And Method Of Manufacturing Silicon Carbide Epitaxial Wafer App 20210010158 - SAKAI; Masashi ; et al.	2021-01-14
Semiconductor device with high quality and reliability wiring connection, and method for manufacturing the same Grant 10,615,131 - Hino	2020-04-07
Semiconductor module, method for manufacturing the same and electric power conversion device Grant 10,546,800 - Hino , et al. Ja	2020-01-28
Semiconductor Device, Power Converter, Method For Manufacturing Semiconductor Device, And Method For Manufacturing Power Convert App 20200027839 - HINO; Yasunari ; et al.	2020-01-23
Power semiconductor device and method for manufacturing same Grant 10,475,721 - Hino , et al. Nov	2019-11-12
Power Semiconductor Device And Method For Manufacturing Same App 20190214326 - HINO; Yasunari ; et al.	2019-07-11
Power semiconductor device and method for manufacturing same Grant 10,283,430 - Hino , et al.	2019-05-07
Semiconductor Module, Method For Manufacturing The Same And Electric Power Conversion Device App 20190131210 - HINO; Yasunari ; et al.	2019-05-02
Semiconductor Device And Method For Manufacturing The Same App 20190122998 - HINO; Yasunari	2019-04-25
Semiconductor module and method for manufacturing the same Grant 9,698,078 - Hino July 4, 2	2017-07-04
Power Semiconductor Device and Method for Manufacturing Same App 20170178995 - HINO; Yasunari ; et al.	2017-06-22
Method for manufacturing semiconductor device Grant 9,627,350 - Hino , et al. April 18, 2	2017-04-18
Method For Manufacturing Semiconductor Device App 20160322327 - HINO; Yasunari ; et al.	2016-11-03
Bonding structure including metal nano particle Grant 9,362,242 - Iwata , et al. June 7, 2	2016-06-07
Semiconductor device and manufacturing method thereof Grant 9,324,684 - Hino April 26, 2	2016-04-26
Semiconductor Device And Manufacturing Method Thereof App 20150130085 - HINO; Yasunari	2015-05-14
Semiconductor Module And Method For Manufacturing The Same App 20150130076 - HINO; Yasunari	2015-05-14
Bonding Structure Including Metal Nano Particles And Bonding Method Using Metal Nano Particles App 20150041827 - IWATA; Aya ; et al.	2015-02-12
Semiconductor device module Grant 8,610,263 - Hino , et al. December 17, 2	2013-12-17
Automotive electric motor-generator with radial plates and circuit boards disposed in a fan shape in a common plane around shaft of rotor Grant 8,319,381 - Hino , et al. November 27, 2	2012-11-27
Automotive Electric Motor-generator With Radial Plates And Circuit Boards Disposed In A Fan Shape In A Common Plane Around Shaft Of Rotor App 20110187212 - HINO; Yasunari ; et al.	2011-08-04
Semiconductor Device Module App 20110180809 - HINO; Yasunari ; et al.	2011-07-28
Automotive electric motor-generator with radial plates and circuit boards disposed in a fan shape in a common plane around shaft of rotor Grant 7,960,880 - Hino , et al. June 14, 2	2011-06-14
Automotive Electric Motor-generator App 20090127945 - Hino; Yasunari ; et al.	2009-05-21
Method for assembling semiconductor switching elements and heat sink in rotary electric machine and rotary electric machine Grant 7,423,342 - Hino , et al. September 9, 2	2008-09-09
Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer Grant 7,151,311 - Nakajima , et al. December 19, 2	2006-12-19
Method for assembling semiconductor switching elements and heat sink in rotary electric machine and rotary electric machine App 20060175906 - Hino; Yasunari ; et al.	2006-08-10
Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer App 20040089928 - Nakajima, Dai ; et al.	2004-05-13

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