Hingerl; Kurt
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hingerl; Kurt.The latest application filed is for "method and device for bonding substrates".
- Hingerl; Kurt - Wolfern AT
- Hingerl; Kurt - Wolfen AT
| Patent | Date |
|---|---|
| Method And Device For Bonding Substrates App 20210202251 - Hingerl; Kurt ; et al. | 2021-07-01 |
| Method and device for bonding substrates Grant 10,971,365 - Hingerl , et al. April 6, 2 | 2021-04-06 |
| Method for Producing a Connection Between Component Parts App 20210035934 - Katz; Simeon ; et al. | 2021-02-04 |
| Method for permanently bonding wafers Grant 10,825,793 - Plach , et al. November 3, 2 | 2020-11-03 |
| Method And Device For Bonding Substrates App 20190393037 - Hingerl; Kurt ; et al. | 2019-12-26 |
| Method For Permanent Bonding Of Wafers App 20190006313 - Plach; Thomas ; et al. | 2019-01-03 |
| Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation Grant 10,163,681 - Martinschitz , et al. Dec | 2018-12-25 |
| Method for permanent bonding of wafers Grant 10,083,933 - Plach , et al. September 25, 2 | 2018-09-25 |
| Method For Permanently Bonding Wafers App 20170229423 - Plach; Thomas ; et al. | 2017-08-10 |
| Method For Permanent Bonding Of Wafers App 20160111394 - Plach; Thomas ; et al. | 2016-04-21 |
| Method for permanent bonding of wafers Grant 9,252,042 - Plach , et al. February 2, 2 | 2016-02-02 |
| Method for permanently bonding wafers Grant 9,159,717 - Plach , et al. October 13, 2 | 2015-10-13 |
| Method And Device For Permanent Bonding Of Wafers App 20150165752 - Plach; Thomas ; et al. | 2015-06-18 |
| Method for permanently bonding wafers Grant 8,975,158 - Plach , et al. March 10, 2 | 2015-03-10 |
| Method For Permanently Bonding Wafers By A Connecting Layer By Means Of Solid State Diffusion Or Phase Transformation App 20140154867 - Martinschitz; Klaus ; et al. | 2014-06-05 |
| Method For Permanently Bonding Wafers App 20140073112 - Plach; Thomas ; et al. | 2014-03-13 |
| Method For Permanently Bonding Wafers App 20140051231 - Plach; Thomas ; et al. | 2014-02-20 |
| Method For Permanently Bonding Wafers App 20140017877 - Plach; Thomas ; et al. | 2014-01-16 |
| Method For Permanent Bonding Of Wafers App 20130299080 - Plach; Thomas ; et al. | 2013-11-14 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 