Himuro; Katsuya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Himuro; Katsuya.The latest application filed is for "low-temperature heat-curable adhesive composition for structure".
- Himuro; Katsuya - Aki-gun JP
- HIMURO; Katsuya - Hiroshima JP
- HIMURO; Katsuya - Hiroshima-shi JP
- HIMURO; Katsuya - Hiroshima-city JP
| Patent | Date |
|---|---|
| Prepreg and molding product thereof Grant 11,059,949 - Hattori , et al. July 13, 2 | 2021-07-13 |
| Low-temperature Heat-curable Adhesive Composition For Structure App 20210102101 - MAKINO; Daisuke ; et al. | 2021-04-08 |
| One-component type thermosetting adhesive composition and body structure for vehicle applying the same Grant 10,774,247 - Nishida , et al. Sept | 2020-09-15 |
| Prepreg And Molding Product Thereof App 20200102436 - Hattori; Koichi ; et al. | 2020-04-02 |
| Vehicle-body structure for vehicle Grant 10,279,843 - Nakagawa , et al. | 2019-05-07 |
| One-component Type Thermosetting Adhesive Composition And Body Structure For Vehicle Applying The Same App 20190062611 - NISHIDA; Takatomi ; et al. | 2019-02-28 |
| Vehicle-body Structure For Vehicle App 20160325785 - NAKAGAWA; Kohya ; et al. | 2016-11-10 |
| Joining structure and method of metal works Grant 8,981,249 - Tanaka , et al. March 17, 2 | 2015-03-17 |
| Joining structure of metal works Grant 7,985,317 - Himuro , et al. July 26, 2 | 2011-07-26 |
| Adhesion Assembly Method And Apparatus Of Article App 20090236039 - TANAKA; Chikara ; et al. | 2009-09-24 |
| Joining Structure Of Metal Works App 20080314515 - HIMURO; Katsuya ; et al. | 2008-12-25 |
| Joining Structure And Method Of Metal Works App 20080237203 - TANAKA; Chikara ; et al. | 2008-10-02 |
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