loadpatents
name:-0.027220964431763
name:-0.015807867050171
name:-0.0007929801940918
Himori; Tsuyoshi Patent Filings

Himori; Tsuyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Himori; Tsuyoshi.The latest application filed is for "wiring board and method for manufacturing same".

Company Profile
0.17.26
  • Himori; Tsuyoshi - Mie JP
  • Himori; Tsuyoshi - Osaka N/A JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wiring Board And Method For Manufacturing Same
App 20140124250 - Iwasaki; Akito ;   et al.
2014-05-08
Circuit board and method of manufacturing the circuit board
Grant 8,658,910 - Kubo , et al. February 25, 2
2014-02-25
Method Of Manufacturing Reuse Paste, Reuse Paste And Method Of Manufacturing Circuit Board Using Reuse Paste
App 20130327478 - HIMORI; Tsuyoshi ;   et al.
2013-12-12
Method Of Manufacturing Reuse Paste, Reuse Paste And Method Of Manufacturing Circuit Board Using Reuse Paste
App 20130327994 - HIMORI; Tsuyoshi ;   et al.
2013-12-12
Multilayer wiring substrate and manufacturing method of multilayer wiring substrate
Grant 8,604,350 - Himori , et al. December 10, 2
2013-12-10
Reuse Paste Manufacturing Method And Reuse Paste
App 20130299752 - HIMORI; Tsuyoshi ;   et al.
2013-11-14
Method of manufacturing circuit board
Grant 8,561,294 - Himori , et al. October 22, 2
2013-10-22
Wiring board, wiring board manufacturing method, and via paste
Grant 8,563,872 - Hirai , et al. October 22, 2
2013-10-22
Circuit Board And Method Of Manufacturing The Circuit Board
App 20130153276 - Kubo; Tetsuro ;   et al.
2013-06-20
Method Of Manufacturing Reuse Paste, Reuse Paste And Method Of Manufacturing Circuit Board Using Reuse Paste
App 20130153138 - Himori; Tsuyoshi ;   et al.
2013-06-20
Reuse Paste Manufacturing Method And Reuse Paste
App 20130146817 - Himori; Tsuyoshi ;   et al.
2013-06-13
Method Of Manufacturing Circuit Board
App 20130097857 - Himori; Tsuyoshi ;   et al.
2013-04-25
Wiring Board, Production Method Of The Same, And Via Paste
App 20130068513 - Hirai; Shogo ;   et al.
2013-03-21
Multilayer Wiring Board And Production Method Of The Same
App 20130062107 - Higuchi; Takayuki ;   et al.
2013-03-14
Method of manufacturing circuit board
Grant 8,393,078 - Himori , et al. March 12, 2
2013-03-12
Multilayer Wiring Board, Production Method Of The Same, And Via Paste
App 20130008698 - Himori; Tsuyoshi ;   et al.
2013-01-10
Method Of Manufacturing Circuit Board
App 20120272520 - Himori; Tsuyoshi ;   et al.
2012-11-01
Wiring Board, Wiring Board Manufacturing Method, And Via Paste
App 20110290549 - Hirai; Shogo ;   et al.
2011-12-01
Multilayer Wiring Substrate And Manufacturing Method Of Multilayer Wiring Substrate
App 20110278051 - Himori; Tsuyoshi ;   et al.
2011-11-17
Mounting board, mounted body, and electronic equipment using the same
Grant 7,667,977 - Sugaya , et al. February 23, 2
2010-02-23
Module component and method for manufacturing the same
Grant 7,659,604 - Fujiwara , et al. February 9, 2
2010-02-09
Electronic part and manufacturing method thereof
Grant 7,510,759 - Himori , et al. March 31, 2
2009-03-31
Mounting Board, Mounted Body, and Electronic Equipment Using the Same
App 20080290497 - Sugaya; Yasuhiro ;   et al.
2008-11-27
Method of forming a module component having a plurality of penetration holes
Grant 7,421,781 - Kimura , et al. September 9, 2
2008-09-09
Module component and method for manufacturing the same
App 20060258050 - Fujiwara; Joji ;   et al.
2006-11-16
Electronic part and manufacturing method thereof
App 20060118905 - Himori; Tsuyoshi ;   et al.
2006-06-08
Module component and method of manufacturing the same
Grant 6,879,493 - Kimura , et al. April 12, 2
2005-04-12
Module component and method of manufacturing the same
Grant 6,806,428 - Kimura , et al. October 19, 2
2004-10-19
Module component and method of manufacturing the same
App 20040165361 - Kimura, Suzushi ;   et al.
2004-08-26
Module component and method of manufacturing the same
App 20020186552 - Kimura, Suzushi ;   et al.
2002-12-12
Resistance wiring board and method for manufacturing the same
Grant 6,166,620 - Inuzuka , et al. December 26, 2
2000-12-26

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