HIMETA; Daisuke
Patent Applications and Registrations
Patent applications and USPTO patent grants for HIMETA; Daisuke.The latest application filed is for "multilayer capacitor".
- HIMETA; Daisuke - Tokyo JP
| Patent | Date |
|---|---|
| Multilayer Capacitor App 20220238279 - ONOUE; Toru ; et al. | 2022-07-28 |
| Electronic component having depression on surface Grant 10,790,091 - Satoh , et al. September 29, 2 | 2020-09-29 |
| Feedthrough capacitor Grant 10,475,587 - Onoue , et al. Nov | 2019-11-12 |
| Electronic component Grant 10,297,390 - Satoh , et al. | 2019-05-21 |
| Feedthrough Capacitor App 20180286583 - ONOUE; Toru ; et al. | 2018-10-04 |
| Electronic Component App 20180082792 - SATOH; Fumiaki ; et al. | 2018-03-22 |
| Electronic Component App 20180082793 - SATOH; Fumiaki ; et al. | 2018-03-22 |
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