Hiltunen; Jari

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hiltunen; Jari.The latest application filed is for "reflowable camera module with improved reliability of solder connections".

Company Profile

0.4.7

Hiltunen; Jari - Mouhijarvi FI
Hiltunen, Jari - Siuro FI

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reflowable camera module with integrated flash Grant 8,130,312 - Hiltunen , et al. March 6, 2	2012-03-06
Multilayer chip scale package Grant 7,939,940 - Hiltunen May 10, 2	2011-05-10
Reflowable camera module with improved reliability of solder connections Grant 7,911,019 - Hiltunen , et al. March 22, 2	2011-03-22
Reflowable Camera Module With Improved Reliability Of Solder Connections App 20100171192 - Hiltunen; Jari ; et al.	2010-07-08
Multilayer Chip Scale Package App 20090152720 - Hiltunen; Jari	2009-06-18
Reflowable Camera Module With Improved Reliability Of Solder Connections App 20090152659 - Hiltunen; Jari ; et al.	2009-06-18
Reflowable Camera Module With Integrated Flash App 20090153729 - Hiltunen; Jari ; et al.	2009-06-18
Image sensing devices, image sensor modules, and associated methods Grant 7,268,335 - Hiltunen September 11, 2	2007-09-11
Image sensing devices, image sensor modules, and associated methods App 20070176086 - Hiltunen; Jari	2007-08-02
Coated wafer level camera modules and associated methods App 20070052827 - Hiltunen; Jari	2007-03-08
Placement of a camera module in a portable device App 20040212718 - Hiltunen, Jari ; et al.	2004-10-28

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