Hillyer; Larry
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hillyer; Larry.The latest application filed is for "method of removing etch residues".
- Hillyer; Larry - Boise ID
| Patent | Date |
|---|---|
| Method and material for removing etch residue from high aspect ratio contact surfaces Grant 7,125,809 - Hillyer , et al. October 24, 2 | 2006-10-24 |
| Method of removing etch residues App 20060128159 - Hillyer; Larry ; et al. | 2006-06-15 |
| Method of removing etch residues Grant 7,022,612 - Hillyer , et al. April 4, 2 | 2006-04-04 |
| High aspect ratio contact surfaces having reduced contaminants Grant 6,847,085 - Hillyer , et al. January 25, 2 | 2005-01-25 |
| High aspect ratio contact surfaces having reduced contaminants App 20040232547 - Hillyer, Larry ; et al. | 2004-11-25 |
| Method of removing etch residues App 20040157462 - Hillyer, Larry ; et al. | 2004-08-12 |
| Method of removing etch residues Grant 6,613,681 - Hillyer , et al. September 2, 2 | 2003-09-02 |
| Method and material for removing etch residue from high aspect ratio contact surfaces App 20020192960 - Hillyer, Larry ; et al. | 2002-12-19 |
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