name:-0.058920860290527
name:-0.038699865341187
name:-0.41019201278687
Hill; Richard J. Patent Filings

Hill; Richard J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hill; Richard J..The latest application filed is for "integrated assemblies and methods of forming integrated assemblies".

Company Profile
36.36.52
  • Hill; Richard J. - Boise ID
  • Hill; Richard J. - Glasgow GB
  • Hill; Richard J. - Philadelphia PA
  • Hill; Richard J. - N. Syracuse NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Integrated Assemblies and Methods of Forming Integrated Assemblies
App 20220310637 - Lowe; Aaron Michael ;   et al.
2022-09-29
Integrated Assemblies and Methods of Forming Integrated Assemblies
App 20220310831 - Hwang; David K. ;   et al.
2022-09-29
Methods of forming apparatuses including air gaps between conductive lines and related apparatuses, memory devices, and electronic systems
Grant 11,456,208 - Gupta , et al. September 27, 2
2022-09-27
Microelectronic Devices Including Isolation Structures Protruding Into Upper Pillar Portions, And Related Methods And Systems
App 20220262820 - King; Matthew J. ;   et al.
2022-08-18
Memory arrays
Grant 11,404,440 - Tang , et al. August 2, 2
2022-08-02
Electronic Devices Comprising A Dielectric Material, And Related Systems And Methods
App 20220238684 - Lindemann; Michael A. ;   et al.
2022-07-28
Integrated assemblies and methods of forming integrated assemblies
Grant 11,393,920 - Hwang , et al. July 19, 2
2022-07-19
Memory Arrays, and Methods of Forming Memory Arrays
App 20220199645 - Kim; Changhan ;   et al.
2022-06-23
Microelectronic Devices Including Tiered Stacks Including Conductive Structures Isolated By Slot Structures, And Related Electronic Systems And Methods
App 20220199641 - Fukuzumi; Yoshiaki ;   et al.
2022-06-23
Integrated Assemblies Having Conductive-Shield-Structures Between Linear-Conductive-Structures
App 20220181254 - Kaushik; Naveen ;   et al.
2022-06-09
Integrated Assemblies Having Vertically-Extending Channel Material with Alternating Regions of Different Dopant Distributions, and Methods of Forming Integrated Assemblies
App 20220173123 - Surthi; Shyam ;   et al.
2022-06-02
Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systems
Grant 11,322,516 - King , et al. May 3, 2
2022-05-03
Integrated Assemblies Having Vertically-Spaced Channel Material Segments, and Methods of Forming Integrated Assemblies
App 20220123018 - Surthi; Shyam ;   et al.
2022-04-21
Memory arrays, and methods of forming memory arrays
Grant 11,302,708 - Kim , et al. April 12, 2
2022-04-12
Integrated assemblies having conductive-shield-structures between linear-conductive-structures
Grant 11,302,628 - Kaushik , et al. April 12, 2
2022-04-12
Integrated Assemblies and Methods of Forming Integrated Assemblies
App 20220102539 - Hwang; David K. ;   et al.
2022-03-31
Integrated assemblies having vertically-extending channel material with alternating regions of different dopant distributions, and methods of forming integrated assemblies
Grant 11,289,501 - Surthi , et al. March 29, 2
2022-03-29
Electronic Devices Comprising Adjoining Oxide Materials And Related Methods And Systems
App 20220077176 - Surthi; Shyam ;   et al.
2022-03-10
Integrated Assemblies, and Methods of Forming Integrated Assemblies
App 20220068317 - Fukuzumi; Yoshiaki ;   et al.
2022-03-03
Integrated Assemblies and Methods of Forming Integrated Assemblies
App 20220068932 - Hwang; David K. ;   et al.
2022-03-03
Microelectronic Devices Including Isolation Structures Protruding Into Upper Pillar Portions, And Related Methods And Systems
App 20220068955 - King; Matthew J. ;   et al.
2022-03-03
Integrated Assemblies and Methods of Forming Integrated Assemblies
App 20220069133 - Hwang; David K. ;   et al.
2022-03-03
Methods Of Forming Apparatuses Including Air Gaps Between Conductive Lines And Related Apparatuses, Memory Devices, And Electronic Systems
App 20220051930 - Gupta; Sidhartha ;   et al.
2022-02-17
Integrated Assemblies and Methods of Forming Integrated Assemblies
App 20220045072 - Surthi; Shyam ;   et al.
2022-02-10
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
Grant 11,244,954 - Surthi , et al. February 8, 2
2022-02-08
Integrated assemblies comprising sense-amplifier-circuitry and wordline-driver-circuitry under memory cells of a memory array
Grant 11,227,861 - Fujisawa , et al. January 18, 2
2022-01-18
Integrated assemblies and methods of forming integrated assemblies
Grant 11,189,629 - Surthi , et al. November 30, 2
2021-11-30
Memory Arrays And Methods Used In Forming A Memory Array
App 20210366525 - Vahdat; Armin Saeedi ;   et al.
2021-11-25
Integrated Assemblies Having Vertically-Spaced Channel Material Segments, and Methods of Forming Integrated Assemblies
App 20210366927 - Kim; Byeung Chul ;   et al.
2021-11-25
Integrated Assemblies and Methods of Forming Integrated Assemblies
App 20210343729 - Surthi; Shyam ;   et al.
2021-11-04
Integrated Assemblies Having Vertically-Spaced Channel Material Segments, and Methods of Forming Integrated Assemblies
App 20210335818 - Surthi; Shyam ;   et al.
2021-10-28
Integrated Assemblies Having Charge-Trapping Material Arranged in Vertically-Spaced Segments, and Methods of Forming Integrated Assemblies
App 20210327898 - Kim; Byeung Chul ;   et al.
2021-10-21
Integrated Assemblies Having Shield Lines Between Digit Lines, and Methods of Forming Integrated Assemblies
App 20210327883 - Tang; Sanh D. ;   et al.
2021-10-21
Memory arrays and methods used in forming a memory array
Grant 11,120,852 - Vahdat , et al. September 14, 2
2021-09-14
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
Grant 11,107,830 - Kim , et al. August 31, 2
2021-08-31
Integrated Assemblies Having Polycrystalline First Semiconductor Material Adjacent Conductively-Doped Second Semiconductor Material
App 20210265467 - Karda; Kamal M. ;   et al.
2021-08-26
Memory Arrays And Methods Used In Forming A Memory Array
App 20210257012 - Vahdat; Armin Saeedi ;   et al.
2021-08-19
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
Grant 11,081,498 - Surthi , et al. August 3, 2
2021-08-03
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
Grant 11,081,497 - Surthi , et al. August 3, 2
2021-08-03
Integrated assemblies having shield lines between digit lines, and methods of forming integrated assemblies
Grant 11,069,687 - Tang , et al. July 20, 2
2021-07-20
Integrated assemblies having polycrystalline first semiconductor material adjacent conductively-doped second semiconductor material
Grant 11,038,027 - Karda , et al. June 15, 2
2021-06-15
Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assemblies
Grant 11,037,956 - Kim , et al. June 15, 2
2021-06-15
Memory Array And A Method Used In Forming A Memory Array
App 20210167089 - Kim; Changhan ;   et al.
2021-06-03
Integrated Assemblies Comprising Sense-Amplifier-Circuitry and Wordline-Driver-Circuitry Under Memory Cells of a Memory Array
App 20210143142 - Fujisawa; Hiroki ;   et al.
2021-05-13
Semiconductor devices comprising conductive patterns of varying dimensions and related systems
Grant 10,998,224 - Light , et al. May 4, 2
2021-05-04
Integrated assemblies comprising sense-amplifier-circuitry and wordline-driver-circuitry under memory cells of a memory array
Grant 10,957,681 - Fujisawa , et al. March 23, 2
2021-03-23
Memory arrays
Grant 10,950,618 - Tang , et al. March 16, 2
2021-03-16
Integrated Assemblies Comprising Sense-Amplifier-Circuitry and Wordline-Driver-Circuitry Under Memory Cells of a Memory Array
App 20210066272 - Fujisawa; Hiroki ;   et al.
2021-03-04
Memory array and a method used in forming a memory array
Grant 10,937,798 - Kim , et al. March 2, 2
2021-03-02
Integrated Assemblies Having Vertically-Spaced Channel Material Segments, and Methods of Forming Integrated Assemblies
App 20210057437 - Surthi; Shyam ;   et al.
2021-02-25
Integrated Assemblies Having Vertically-Spaced Channel Material Segments, and Methods of Forming Integrated Assemblies
App 20210057434 - Surthi; Shyam ;   et al.
2021-02-25
Integrated Assemblies Having Vertically-Spaced Channel Material Segments, and Methods of Forming Integrated Assemblies
App 20210057436 - Kim; Byeung Chul ;   et al.
2021-02-25
Integrated Assemblies Having Vertically-Spaced Channel Material Segments, and Methods of Forming Integrated Assemblies
App 20210057435 - Surthi; Shyam ;   et al.
2021-02-25
Capacitance reduction in a semiconductor device
Grant 10,923,480 - Surthi , et al. February 16, 2
2021-02-16
Memory Arrays
App 20210013226 - Tang; Sanh D. ;   et al.
2021-01-14
Integrated Assemblies Having Charge-Trapping Material Arranged in Vertically-Spaced Segments, and Methods of Forming Integrated Assemblies
App 20200373325 - Kim; Byeung Chul ;   et al.
2020-11-26
Integrated Assemblies Having Vertically-Extending Channel Material with Alternating Regions of Different Dopant Distributions, and Methods of Forming Integrated Assemblies
App 20200373322 - Surthi; Shyam ;   et al.
2020-11-26
Capacitance Reduction In A Semiconductor Device
App 20200357803 - Surthi; Shyam ;   et al.
2020-11-12
Recessed access devices and DRAM constructions
Grant 10,825,816 - Gao , et al. November 3, 2
2020-11-03
Integrated Assemblies Having Charge-Trapping Material Arranged in Vertically-Spaced Segments, and Methods of Forming Integrated Assemblies
App 20200321351 - Kim; Byeung Chul ;   et al.
2020-10-08
Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assemblies
Grant 10,777,576 - Kim , et al. Sept
2020-09-15
Integrated Assemblies Having Polycrystalline First Semiconductor Material Adjacent Conductively-Doped Second Semiconductor Mater
App 20200287003 - Karda; Kamal M. ;   et al.
2020-09-10
Integrated Assemblies Having Shield Lines Between Digit Lines, and Methods of Forming Integrated Assemblies
App 20200286895 - Tang; Sanh D. ;   et al.
2020-09-10
Method used in forming integrated circuitry
Grant 10,770,465 - Kim , et al. Sep
2020-09-08
Three-dimensional Dynamic Random-access Memory Array
App 20200212041 - Machkaoutsan; Vladimir ;   et al.
2020-07-02
Memory Arrays
App 20200176465 - Tang; Sanh D. ;   et al.
2020-06-04
Memory Array And A Method Used In Forming A Memory Array
App 20200144283 - Kim; Changhan ;   et al.
2020-05-07
Methods of forming a transistor and methods of forming an array of memory cells
Grant 10,643,906 - Hwang , et al.
2020-05-05
Memory Arrays, and Methods of Forming Memory Arrays
App 20200075630 - Kim; Changhan ;   et al.
2020-03-05
Conductive Patterns, Semiconductor Devices Comprising The Conductive Patterns, And Related Methods And Systems
App 20200066578 - Light; Scott L. ;   et al.
2020-02-27
Memory arrays, and methods of forming memory arrays
Grant 10,541,252 - Daycock , et al. Ja
2020-01-21
Methods of forming a pattern
Grant 10,522,395 - Light , et al. Dec
2019-12-31
Arrays of elevationally-extending strings of memory cells and methods of forming memory arrays
Grant 10,504,917 - Sandhu , et al. Dec
2019-12-10
Memory arrays
Grant 10,497,715 - Kim , et al. De
2019-12-03
Memory Arrays, and Methods of Forming Memory Arrays
App 20190267396 - Daycock; David ;   et al.
2019-08-29
Recessed Access Devices And DRAM Constructions
App 20190206870 - Gao; Yunfei ;   et al.
2019-07-04
Memory Arrays
App 20190198520 - Kim; Changhan ;   et al.
2019-06-27
Methods Of Forming A Transistor And Methods Of Forming An Array Of Memory Cells
App 20190189515 - Hwang; David K. ;   et al.
2019-06-20
Memory arrays, and methods of forming memory arrays
Grant 10,304,853 - Daycock , et al.
2019-05-28
Memory Arrays, and Methods of Forming Memory Arrays
App 20180323212 - Daycock; David ;   et al.
2018-11-08
Arrays Of Elevationally-Extending Strings Of Memory Cells And Methods Of Forming Memory Arrays
App 20180315771 - Sandhu; Gurtej S. ;   et al.
2018-11-01
Memory arrays, and methods of forming memory arrays
Grant 10,083,981 - Daycock , et al. September 25, 2
2018-09-25
Memory Arrays, and Methods of Forming Memory Arrays
App 20180219021 - Daycock; David ;   et al.
2018-08-02
Arrays of elevationally-extending strings of memory cells and methods of forming memory arrays
Grant 9,985,049 - Sandhu , et al. May 29, 2
2018-05-29
III-V MOSFET fabrication and device
Grant 7,842,587 - Passlack , et al. November 30, 2
2010-11-30
III-V MOSFET Fabrication and Device
App 20090189252 - Passlack; Matthias ;   et al.
2009-07-30
Styptic composition
Grant 5,279,837 - Hill January 18, 1
1994-01-18
Method of electroding a poly(vinylidene fluoride) solid
Grant 4,466,874 - Belke, Jr. , et al. August 21, 1
1984-08-21
Company Registrations
NCAGE Code733S3HILL, RICHARD J
CAGE Code733S3HILL, RICHARD J HILL, RICHARD G
S.A.M. Registration733S3 [79331890]HILL, RICHARD J

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