HILL; Richard F.

Patent Applications and Registrations

Patent applications and USPTO patent grants for HILL; Richard F..The latest application filed is for "compressible foamed thermal interface materials and methods of making the same".

Company Profile

3.26.35

HILL; Richard F. - Parkman OH
Hill; Richard F - Cleveland OH
Hill; Richard F. - Cleveland OH
Hill; Richard F. - Easthampton MA
Hill; Richard F. - Chagrin Falls OH
Hill; Richard F. - Cold Spring NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Compressible Foamed Thermal Interface Materials And Methods Of Making The Same App 20220246572 - RAJAGOPAL; Vijayaraghavan ; et al.	2022-08-04
Compressible foamed thermal interface materials and methods of making the same Grant 11,276,662 - Rajagopal , et al. March 15, 2	2022-03-15
Methods For Establishing Thermal Joints Between Heat Spreaders Or Lids And Heat Sources App 20210202343 - STRADER; Jason L. ; et al.	2021-07-01
Methods for establishing thermal joints between heat spreaders or lids and heat sources Grant 10,964,617 - Strader , et al. March 30, 2	2021-03-30
Methods For Establishing Thermal Joints Between Heat Spreaders Or Lids And Heat Sources App 20200219785 - STRADER; Jason L. ; et al.	2020-07-09
Methods for establishing thermal joints between heat spreaders or lids and heat sources Grant 10,600,714 - Strader , et al.	2020-03-24
Methods for Establishing Thermal Joints Between Heat Spreaders or Lids and Heat Sources App 20190371697 - STRADER; Jason L. ; et al.	2019-12-05
Compressible Foamed Thermal Interface Materials and Methods of Making the Same App 20190348388 - RAJAGOPAL; Vijayaraghavan ; et al.	2019-11-14
Methods for establishing thermal joints between heat spreaders or lids and heat sources Grant 10,373,891 - Strader , et al.	2019-08-06
Thermal interface materials Grant 9,515,004 - Strader , et al. December 6, 2	2016-12-06
Reusable Thermoplastic Thermal Interface Materials And Methods For Establishing Thermal Joints Between Heat Sources And Heat Dissipating/removal Structures App 20160315030 - Strader; Jason L. ; et al.	2016-10-27
Thermal interface material assemblies and related methods Grant 9,330,998 - Strader , et al. May 3, 2	2016-05-03
Circuit assemblies including thermoelectric modules Grant 9,322,580 - Hershberger , et al. April 26, 2	2016-04-26
Assemblies and methods for dissipating heat from handheld electronic devices Grant 9,258,928 - Hill , et al. February 9, 2	2016-02-09
Compliant multilayered thermally-conductive interface assemblies Grant 9,222,735 - Hill , et al. December 29, 2	2015-12-29
Thermal Interface Materials With Thin Film Sealants App 20150334871 - Hill; Richard F. ; et al.	2015-11-19
Thermal Solutions and Methods for Dissipating Heat from Electronic Devices Using the Same Side of an Anisotropic Heat Spreader App 20150301568 - Hill; Richard F. ; et al.	2015-10-22
Thermal Interface Material Assemblies And Related Methods App 20150305189 - Strader; Jason L. ; et al.	2015-10-22
Compliant Multilayered Thermally-conductive Interface Assemblies App 20140374080 - Hill; Richard F. ; et al.	2014-12-25
Methods For Establishing Thermal Joints Between Heat Spreaders and Heat Generating Components Using Thermoplastic and/or Self-Healing Thermal Interface Materials App 20140368992 - Strader; Jason L. ; et al.	2014-12-18
Methods For Establishing Thermal Joints Between Heat Spreaders Or Lids And Heat Sources App 20140367847 - Strader; Jason L. ; et al.	2014-12-18
Thermal Interface Materials App 20140262191 - Strader; Jason L. ; et al.	2014-09-18
Memory modules including compliant multilayered thermally-conductive interface assemblies Grant 8,837,151 - Hill , et al. September 16, 2	2014-09-16
Circuit Assemblies Including Thermoelectric Modules App 20140150839 - Hershberger; Jeffrey Gerard ; et al.	2014-06-05
Circuit assemblies including thermoelectric modules Grant 8,649,179 - Hershberger , et al. February 11, 2	2014-02-11
Thermal interface material assemblies, and related methods Grant 8,647,752 - Strader , et al. February 11, 2	2014-02-11
Assemblies And Methods For Dissipating Heat From Handheld Electronic Devices App 20130265722 - Hill; Richard F. ; et al.	2013-10-10
Assemblies and methods for dissipating heat from handheld electronic devices Grant 8,477,499 - Hill , et al. July 2, 2	2013-07-02
Thermal Interface Materials And Methods For Processing The Same App 20120292005 - Bruzda; Karen ; et al.	2012-11-22
Circuit Assemblies Including Thermoelectric Modules App 20120201008 - Hershberger; Jeffrey Gerard ; et al.	2012-08-09
Thermoelectric Modules, Thermoelectric Assemblies, and Related Methods App 20120174956 - Smythe; Robert Michael ; et al.	2012-07-12
Memory Modules Including Compliant Multilayered Thermally-Conductive Interface Assemblies App 20120087094 - Hill; Richard F. ; et al.	2012-04-12
Potato Shaped Graphite Filler, Thermal Interface Materials And Emi Shielding App 20120080639 - Bruzda; Karen ; et al.	2012-04-05
Compliant Multilayered Thermally-conductive Interface Assemblies Having Emi Shielding Properties App 20120061135 - Hill; Richard F. ; et al.	2012-03-15
Conductive Films for EMI Shielding Applications App 20120012382 - McBain; Douglas ; et al.	2012-01-19
Thermal Interface Material Assemblies, And Related Methods App 20110310562 - Strader; Jason L. ; et al.	2011-12-22
Memory modules including compliant multilayered thermally-conductive interface assemblies Grant 8,081,468 - Hill , et al. December 20, 2	2011-12-20
Assemblies And Methods For Dissipating Heat From Handheld Electronic Devices App 20110242764 - Hill; Richard F. ; et al.	2011-10-06
Assemblies and methods for dissipating heat from handheld electronic devices Grant 7,965,514 - Hill , et al. June 21, 2	2011-06-21
Thermoelectric Modules And Related Methods App 20110030754 - Smythe; Robert Michael ; et al.	2011-02-10
Apparatus Including Locking Means And Enclosure With Locking Means App 20110001404 - Lear; Jerel Richard ; et al.	2011-01-06
Flexible Assemblies With Integrated Thermoelectric Modules Suitable For Use In Extracting Power From Or Dissipating Heat From Fluid Conduits App 20110000516 - Hershberger; Jeffrey Gerard ; et al.	2011-01-06
Memory Modules Including Compliant Multilayered Thermally-conductive Interface Assemblies App 20100321895 - Hill; Richard F. ; et al.	2010-12-23
Compliant Multilayered Thermally-conductive Interface Assemblies App 20100321897 - Hill; Richard F. ; et al.	2010-12-23
Assemblies And Methods For Dissipating Heat From Handheld Electronic Devices App 20100309631 - Hill; Richard F. ; et al.	2010-12-09
Flexible assemblies with integrated thermoelectric modules suitable for use in extracting power from or dissipating heat from fluid conduits Grant 7,765,811 - Hershberger , et al. August 3, 2	2010-08-03
Flexible Assemblies With Integrated Thermoelectric Modules Suitable For Use In Extracting Power From Or Dissipating Heat From Fluid Conduits App 20090000309 - Hershberger; Jeffrey Gerard ; et al.	2009-01-01
Thermal interface structure for placement between a microelectronic component package and heat sink Grant 6,940,721 - Hill September 6, 2	2005-09-06
Heat spreading thermal interface structure App 20050045372 - Hill, Richard F. ; et al.	2005-03-03
Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink Grant 6,761,928 - Hill , et al. July 13, 2	2004-07-13
Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink Grant 6,617,517 - Hill , et al. September 9, 2	2003-09-09
Thermal interface structure for placement between a microelectronic component package and heat sink App 20030007329 - Hill, Richard F.	2003-01-09
Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink App 20020154485 - Hill, Richard F. ; et al.	2002-10-24
Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink App 20020148635 - Hill, Richard F. ; et al.	2002-10-17
Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink Grant 6,372,997 - Hill , et al. April 16, 2	2002-04-16
Cordierite composition and method of production Grant 5,139,976 - Terbot , et al. August 18, 1	1992-08-18
Process for preparing aluminum alkoxides Grant 4,242,271 - Weber , et al. December 30, 1	1980-12-30

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