Hikita; Junichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hikita; Junichi.The latest application filed is for "personal identification device and electronic apparatus provided therewith".

Company Profile

0.34.18

Hikita; Junichi - Kyoto JP
Hikita, Junichi - Kyoto-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Personal identification device and electronic apparatus provided therewith Grant 7,961,918 - Hikita , et al. June 14, 2	2011-06-14
Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip Grant 7,589,415 - Hikita , et al. September 15, 2	2009-09-15
Personal Identification Device and Electronic Apparatus Provided Therewith App 20080008365 - Hikita; Junichi ; et al.	2008-01-10
Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface Grant 7,307,349 - Hikita , et al. December 11, 2	2007-12-11
Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips Grant 7,226,336 - Hikita , et al. June 5, 2	2007-06-05
Semiconductor device and semiconductor chip for use therein Grant 7,126,226 - Hikita , et al. October 24, 2	2006-10-24
Semiconductor device for radio communication device, and radio communication device using said semiconductor device Grant 7,088,983 - Hikita , et al. August 8, 2	2006-08-08
Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips App 20060172666 - Hikita; Junichi ; et al.	2006-08-03
Semiconductor device and semiconductor chip for use therein Grant 7,045,386 - Hikita , et al. May 16, 2	2006-05-16
Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device Grant 7,045,900 - Hikita , et al. May 16, 2	2006-05-16
Production process for semiconductor device Grant 7,009,294 - Hikita , et al. March 7, 2	2006-03-07
Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface App 20050253274 - Hikita, Junichi ; et al.	2005-11-17
Semiconductor device of chip-on-chip structure Grant 6,965,166 - Hikita , et al. November 15, 2	2005-11-15
Semiconductor device and manufacturing method thereof Grant 6,897,091 - Hikita , et al. May 24, 2	2005-05-24
Semiconductor chip, chip-on-chip structure device, and assembling method thereof Grant 6,869,829 - Hikita , et al. March 22, 2	2005-03-22
Authentication system, authentication device, authentication data producing device, and authentication method Grant 6,842,859 - Hikita , et al. January 11, 2	2005-01-11
Semiconductor device having a primary chip with bumps in joined registration with bumps of a plurality of secondary chips Grant 6,838,312 - Hikita , et al. January 4, 2	2005-01-04
Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device App 20040222521 - Hikita, Junichi ; et al.	2004-11-11
Production process for semiconductor device App 20040152236 - Hikita, Junichi ; et al.	2004-08-05
Data communication transponder and communications system employing it Grant 6,747,546 - Hikita , et al. June 8, 2	2004-06-08
IC card and method of using IC card Grant 6,742,117 - Hikita , et al. May 25, 2	2004-05-25
Communications system having an authentication function Grant 6,724,296 - Hikita , et al. April 20, 2	2004-04-20
Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device Grant 6,724,084 - Hikita , et al. April 20, 2	2004-04-20
Semiconductor device having a primary chip with bumps in joined registration with bumps of a plurality of secondary chips Grant 6,717,244 - Hikita , et al. April 6, 2	2004-04-06
Semiconductor device for radio communication device, and radio communication device using said semiconductor device App 20040043732 - Hikita, Junichi ; et al.	2004-03-04
Production process for semiconductor device Grant 6,696,347 - Hikita , et al. February 24, 2	2004-02-24
Semiconductor device and semiconductor chip for use therein App 20040026790 - Hikita, Junichi ; et al.	2004-02-12
Non contact type IC card Grant 6,679,424 - Hikita , et al. January 20, 2	2004-01-20
Semiconductor chip and semiconductor device of chip-on-chip structure Grant 6,657,309 - Hikita , et al. December 2, 2	2003-12-02
Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips Grant 6,635,512 - Hikita , et al. October 21, 2	2003-10-21
Semiconductor device and semiconductor chip for use therein Grant 6,617,693 - Hikita , et al. September 9, 2	2003-09-09
Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface App 20030146518 - Hikita, Junichi ; et al.	2003-08-07
Semiconductor device having a primary chip with bumps in joined registration with bumps of a plurality of secondary chips App 20030122248 - Hikita, Junichi ; et al.	2003-07-03
Non contact type IC card App 20030066895 - Hikita, Junichi ; et al.	2003-04-10
Semiconductor chip and multichip-type semiconductor device Grant 6,507,117 - Hikita , et al. January 14, 2	2003-01-14
Semiconductor chip, chip-on-chip structure device, and assembling method thereof App 20020190369 - Hikita, Junichi ; et al.	2002-12-19
Semiconductor device and semiconductor chip for use therein App 20020192866 - Hikita, Junichi ; et al.	2002-12-19
Non-contact Ic Card App 20020162893 - HIKITA, JUNICHI ; et al.	2002-11-07
Semiconductor chip, chip-on-chip structure device and assembling method thereof Grant 6,476,499 - Hikita , et al. November 5, 2	2002-11-05
Semiconductor chip and semiconductor device having a chip-on-chip structure Grant 6,462,420 - Hikita , et al. October 8, 2	2002-10-08
Semiconductor device and method for manufacturing thereof Grant 6,458,609 - Hikita , et al. October 1, 2	2002-10-01
Semiconductor device and manufacturing method thereof App 20020127777 - Hikita, Junichi ; et al.	2002-09-12
Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip App 20020109133 - Hikita, Junichi ; et al.	2002-08-15
Semiconductor device and semiconductor chip Grant 6,404,061 - Hikita , et al. June 11, 2	2002-06-11
Method of forming through-holes in a wafer and then dicing to form stacked semiconductor devices Grant 6,391,685 - Hikita , et al. May 21, 2	2002-05-21
Semiconductor chip and semiconductor device having a chip-on-chip structure App 20020056899 - Hikita, Junichi ; et al.	2002-05-16
Semiconductor device Grant 6,369,407 - Hikita , et al. April 9, 2	2002-04-09
Semiconductor device App 20020020904 - Hikita, Junichi ; et al.	2002-02-21
Semiconductor device and semiconductor chip for use therein App 20020017718 - Hikita, Junichi ; et al.	2002-02-14
Semiconductor device of chip-on-chip structure and semiconductor chip for use therein Grant 6,232,668 - Hikita , et al. May 15, 2	2001-05-15
Semiconductor device having a plurality of semiconductor chips Grant 6,133,637 - Hikita , et al. October 17, 2	2000-10-17
Semiconductor device with package Grant 6,046,506 - Hikita , et al. April 4, 2	2000-04-04

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