Hikida; Eiji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hikida; Eiji.The latest application filed is for "shrink label".
- Hikida; Eiji - Bardstown KY
- Hikida; Eiji - Osaka-shi JP
- Hikida; Eiji - Tokyo JP
- Hikida; Eiji - Osaka JP
- Hikida; Eiji - Osaka-shi Osaka JP
| Patent | Date |
|---|---|
| Shrink sleeve film Grant D809,402 - Hikida February 6, 2 | 2018-02-06 |
| Shrink Label App 20160368251 - Banno; Shinji ; et al. | 2016-12-22 |
| Shrink Label And Method For Producing Same App 20160284248 - Banno; Shinji ; et al. | 2016-09-29 |
| Heat-shrinkable cylindrical label, long cylindrical body, and cylindrical-label-attached article Grant 8,173,231 - Hikida , et al. May 8, 2 | 2012-05-08 |
| Heat-shrinkable Cylindrical Label, Long Cylindrical Body, And Cylindrical-label-attached Article App 20110052846 - Hikida; Eiji ; et al. | 2011-03-03 |
| Shrinkable Label Having A Hologram Layer And Container With The Label App 20100178438 - Hikida; Eiji ; et al. | 2010-07-15 |
| Shrinkable Label Having A Hologram Layer And Container With The Label App 20100173229 - Hikida; Eiji ; et al. | 2010-07-08 |
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