Hijikata; Isamu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hijikata; Isamu.The latest application filed is for "object handling devices".
- Hijikata; Isamu - Kanagawa JP
- Hijikata; Isamu - Tokyo JP
| Patent | Date |
|---|---|
| Object handling devices Grant 5,584,647 - Uehara , et al. * December 17, 1 | 1996-12-17 |
| Plasma taper etching for semiconductor device fabrication Grant 5,254,214 - Hijikata , et al. October 19, 1 | 1993-10-19 |
| Object handling device Grant 5,083,896 - Uehara , et al. January 28, 1 | 1992-01-28 |
| Electrode for use in the treatment of an object in a plasma Grant 5,022,979 - Hijikata , et al. June 11, 1 | 1991-06-11 |
| Electrode for use in the treatment of an object in a plasma Grant 5,006,220 - Hijikata , et al. April 9, 1 | 1991-04-09 |
| Method for improving film quality of silica-based films Grant 4,900,582 - Nakayama , et al. February 13, 1 | 1990-02-13 |
| Method of forming silicone film Grant 4,894,254 - Nakayama , et al. January 16, 1 | 1990-01-16 |
| Surface treatment of silicone-based coating films Grant 4,868,096 - Nakayama , et al. September 19, 1 | 1989-09-19 |
| Automatic plasma processing device and heat treatment device Grant 4,550,239 - Uehara , et al. October 29, 1 | 1985-10-29 |
| Automatic plasma processing device and heat treatment device for batch treatment of workpieces Grant 4,550,242 - Uehara , et al. October 29, 1 | 1985-10-29 |
| Automatic apparatus for continuous treatment of leaf materials with gas plasma Grant 4,483,651 - Nakane , et al. November 20, 1 | 1984-11-20 |
| Apparatus for the treatment of semiconductor wafers by plasma reaction Grant 4,318,767 - Hijikata , et al. March 9, 1 | 1982-03-09 |
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