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Hiiti Aktiengesellschaft Patent Filings

Hiiti Aktiengesellschaft

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hiiti Aktiengesellschaft.The latest application filed is for "curing composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system".

Company Profile
7.1.6
  • Hiiti Aktiengesellschaft - Schaan LI
  • HiIti Aktiengesellschaft; - Schaan LI
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Curing composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system
App 20210324134 - Behrens; Nicole ;   et al.
2021-10-21
Tool
App 20190344352 - Momeni; Siavash ;   et al.
2019-11-14
Isolation block, method for sealing a flute of a fluted metal deck, and wall and deck configuration
Grant 10,472,819 - Klein , et al. Nov
2019-11-12
Fire Protection Sleeve
App 20190195395 - Muenzenberger; Herbert
2019-06-27
Method for Comparing a Received Beam Incident on a Laser Receiver with a Rotating Laser Beam
App 20190154444 - LUKIC; Sasha ;   et al.
2019-05-23
Clamp
App 20130149030 - Merhar; Thomas ;   et al.
2013-06-13

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