Higuchi; Reiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Higuchi; Reiji.The latest application filed is for "conductive film laminate and touch panel using the same".

Company Profile

0.17.18

Higuchi; Reiji - Haibara-gun JP
Higuchi; Reiji - Aichi JP
HIGUCHI; Reiji - Ashigara-kami-gun JP
HIGUCHI; Reiji - Kanagawa JP
Higuchi; Reiji - Aichi-ken JP
Higuchi; Reiji - Sakura N/A JP
Higuchi; Reiji - Sakura-shi JP
Higuchi; Reiji - Chiba JP
Higuchi, Reiji - Sakura-shi Chiba JP
Higuchi; Reiji - Tokyo JP
Higuchi; Reiji - Kawasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
IR cut filter, method for manufacturing the same, and solid-state imaging device Grant 9,952,361 - Higuchi , et al. April 24, 2	2018-04-24
Shift device Grant 9,939,060 - Kato , et al. April 10, 2	2018-04-10
Support plate for solid-state imaging element, method for manufacturing the same, and solid-state imaging device Grant 9,571,706 - Murayama , et al. February 14, 2	2017-02-14
Conductive Film Laminate And Touch Panel Using The Same App 20160362586 - KIYOTO; Naoharu ; et al.	2016-12-15
Shift Device App 20160273648 - KATO; Daisuke ; et al.	2016-09-22
Laminate For Touch Panel And Flat Panel Display App 20160253035 - MITAMURA; Yasuhiro ; et al.	2016-09-01
Laminate For Touch Panel App 20160216809 - SHIBATA; Michihiro ; et al.	2016-07-28
Ir Cut Filter, Method For Manufacturing The Same, And Solid-state Imaging Device App 20150260886 - HIGUCHI; Reiji ; et al.	2015-09-17
Support Plate For Solid-state Imaging Element, Method For Manufacturing The Same , And Solid-state Imaging Device App 20150264231 - MURAYAMA; Satoru ; et al.	2015-09-17
Shift device Grant 9,074,675 - Kato , et al. July 7, 2	2015-07-07
Shift device Grant 9,032,828 - Kato , et al. May 19, 2	2015-05-19
Shift Device App 20140144274 - KATO; Masashi ; et al.	2014-05-29
Shift Device App 20140144273 - KATO; Masashi ; et al.	2014-05-29
Multi-layer board manufacturing method thereof Grant 8,726,495 - Nakao , et al. May 20, 2	2014-05-20
Key and locking device Grant 8,210,010 - Higuchi July 3, 2	2012-07-03
Key And Locking Device App 20110302972 - HIGUCHI; Reiji	2011-12-15
Printed wiring board and production method thereof Grant 7,776,199 - Fujinami , et al. August 17, 2	2010-08-17
Multi-layer Board Manufacturing Method Thereof App 20080250634 - NAKAO; Osamu ; et al.	2008-10-16
Multilayer board manufacturing method Grant 7,421,779 - Nakao , et al. September 9, 2	2008-09-09
Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method Grant 7,312,400 - Ito , et al. December 25, 2	2007-12-25
Printed wiring board and production method thereof App 20070158104 - Fujinami; Hideyuki ; et al.	2007-07-12
Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof Grant 7,122,746 - Higuchi , et al. October 17, 2	2006-10-17
Multilayer board and its manufacturing method App 20060191133 - Nakao; Osamu ; et al.	2006-08-31
Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method App 20050155792 - Ito, Shoji ; et al.	2005-07-21
Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof Grant 6,914,199 - Higuchi , et al. July 5, 2	2005-07-05
Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof Grant 6,914,200 - Higuchi , et al. July 5, 2	2005-07-05
Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof App 20050016765 - Higuchi, Reiji ; et al.	2005-01-27
Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof Grant 6,831,236 - Higuchi , et al. December 14, 2	2004-12-14
Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof App 20040195002 - Higuchi, Reiji ; et al.	2004-10-07
Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof App 20040198053 - Higuchi, Reiji ; et al.	2004-10-07
Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof Grant 6,768,064 - Higuchi , et al. July 27, 2	2004-07-27
Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof App 20030019662 - Higuchi, Reiji ; et al.	2003-01-30
Ethylene/.alpha.-olefin copolymer Grant 6,492,475 - Egashira , et al. December 10, 2	2002-12-10
Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof App 20020134584 - Higuchi, Reiji ; et al.	2002-09-26

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