Higo; Kazunaga
Patent Applications and Registrations
Patent applications and USPTO patent grants for Higo; Kazunaga.The latest application filed is for "component-incorporated wiring substrate and method of manufacturing the same".
- Higo; Kazunaga - Iida JP
- Higo; Kazunaga - Inuyama N/A JP
- HIGO; Kazunaga - Iida-shi JP
- HIGO; Kazunaga - lida-shi JP
- HIGO; Kazunaga - Inuyama-shi JP
| Patent | Date |
|---|---|
| Component-incorporated wiring substrate and method of manufacturing the same Grant 8,952,262 - Yamashita , et al. February 10, 2 | 2015-02-10 |
| Wiring board Grant 8,809,692 - Yamada , et al. August 19, 2 | 2014-08-19 |
| Wiring board and method of manufacturing the same Grant 8,785,786 - Yamada , et al. July 22, 2 | 2014-07-22 |
| Wiring substrate and method of manufacturing the same Grant 8,674,236 - Higo , et al. March 18, 2 | 2014-03-18 |
| Method of fabricating wiring board Grant 8,387,241 - Muramatsu , et al. March 5, 2 | 2013-03-05 |
| Component-incorporated Wiring Substrate And Method Of Manufacturing The Same App 20130048361 - YAMASHITA; Daisuke ; et al. | 2013-02-28 |
| Method For Manufacturing Wiring Substrate App 20130025782 - HIGO; Kazunaga ; et al. | 2013-01-31 |
| Wiring Substrate And Method Of Manufacturing The Same App 20120205142 - HIGO; Kazunaga ; et al. | 2012-08-16 |
| Wiring Board App 20120152596 - YAMADA; Erina ; et al. | 2012-06-21 |
| Wiring Board And Method Of Manufacturing The Same App 20120152597 - YAMADA; Erina ; et al. | 2012-06-21 |
| Wiring Board And Method Of Manufacturing The Same App 20120152598 - YAMADA; Erina ; et al. | 2012-06-21 |
| Method of Fabricating Wiring Board App 20110232085 - MURAMATSU; Masaki ; et al. | 2011-09-29 |
| Multilayer Wiring Board App 20110232943 - HIDA; Toshinori ; et al. | 2011-09-29 |
| Wiring board providing impedance matching Grant 7,339,260 - Sugimoto , et al. March 4, 2 | 2008-03-04 |
| Wiring board App 20060043572 - Sugimoto; Yasuhiro ; et al. | 2006-03-02 |
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