| Patent | Date |
|---|
Packaged integrated circuit having stacked die and method for therefor
Grant 10,446,476 - Higgins, III , et al. Oc | 2019-10-15 |
Variable stealth laser dicing process
Grant 10,347,534 - Lapke , et al. July 9, 2 | 2019-07-09 |
Surface finish for wirebonding
Grant 10,325,876 - Mathew , et al. | 2019-06-18 |
Packaged integrated circuit device and methods
Grant 10,249,557 - Higgins, III , et al. | 2019-04-02 |
Packaged semiconductor device and method for forming
Grant 10,242,935 - Carpenter , et al. | 2019-03-26 |
Packaged Integrated Circuit Having Stacked Die And Method For Therefor
App 20190088576 - HIGGINS, III; LEO M. ; et al. | 2019-03-21 |
Variable Stealth Laser Dicing Process
App 20190080963 - LAPKE; Martin ; et al. | 2019-03-14 |
Packaged Semiconductor Device And Method For Forming
App 20190067172 - Carpenter; Burton Jesse ; et al. | 2019-02-28 |
Packaged Integrated Circuit Device And Methods
App 20180342444 - HIGGINS, III; Leo M. ; et al. | 2018-11-29 |
Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material
Grant 10,037,965 - Higgins, III July 31, 2 | 2018-07-31 |
Laser sintered interconnections between die
Grant 9,935,079 - Foong , et al. April 3, 2 | 2018-04-03 |
Methods for manufacturing a packaged device with an extended structure for forming an opening in the encapsulant
Grant 9,899,290 - Higgins, III February 20, 2 | 2018-02-20 |
Packaged device with extended structure for forming an opening in the encapsualant
App 20170278768 - Higgins, III; Leo M. | 2017-09-28 |
Wire bond mold lock method and structure
Grant 9,685,351 - Higgins, III June 20, 2 | 2017-06-20 |
Semiconductor Device With Protective Material And Method For Encapsulating
App 20170040282 - HIGGINS, III; Leo M. | 2017-02-09 |
Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion
Grant 9,508,622 - Higgins, III November 29, 2 | 2016-11-29 |
Sensing field effect transistor devices and method of their manufacture
Grant 9,470,652 - Hooper , et al. October 18, 2 | 2016-10-18 |
Method and apparatus for assembling a semiconductor package
Grant 9,461,009 - Higgins, III , et al. October 4, 2 | 2016-10-04 |
Copper ball bond features and structure
Grant 9,461,012 - Higgins, III , et al. October 4, 2 | 2016-10-04 |
Semiconductor devices with compliant interconnects
Grant 9,324,667 - Uehling , et al. April 26, 2 | 2016-04-26 |
Packaged semiconductor device
Grant 9,287,200 - Higgins, III March 15, 2 | 2016-03-15 |
Thermally enhanced package with lid heat spreader
Grant 9,269,648 - Higgins, III February 23, 2 | 2016-02-23 |
Wire Bond Mold Lock Method and Structure
App 20160020182 - Higgins, III; Leo M. | 2016-01-21 |
Surface Finish For Wirebonding
App 20150380376 - MATHEW; VARUGHESE ; et al. | 2015-12-31 |
Method for plating a semiconductor package lead
Grant 9,224,651 - Higgins, III December 29, 2 | 2015-12-29 |
Die-to-die inductive communication devices and methods
Grant 9,219,028 - Higgins, III , et al. December 22, 2 | 2015-12-22 |
Method for forming a semiconductor device assembly having a heat spreader
Grant 9,111,878 - Higgins, III , et al. August 18, 2 | 2015-08-18 |
Semiconductor device
Grant 9,111,952 - Higgins, III , et al. August 18, 2 | 2015-08-18 |
Encapsulant for a semiconductor device
Grant 9,093,383 - Chopin , et al. July 28, 2 | 2015-07-28 |
Method for forming die assembly with heat spreader
Grant 9,059,144 - Higgins, III , et al. June 16, 2 | 2015-06-16 |
Thermally Enhanced Package with Lid Heat Spreader
App 20150145114 - Higgins, III; Leo M. | 2015-05-28 |
Method For Treating A Bond Pad Of A Package Substrate
App 20150118791 - Mathew; Varughese ; et al. | 2015-04-30 |
Method for treating a bond pad of a package substrate
Grant 9,012,263 - Mathew , et al. April 21, 2 | 2015-04-21 |
Copper Ball Bond Features and Structure
App 20150084199 - Higgins, III; Leo M. ; et al. | 2015-03-26 |
Methods and structures for reducing stress on die assembly
Grant 8,970,026 - Leal , et al. March 3, 2 | 2015-03-03 |
Mold compound compatibility test system and methods thereof
Grant 8,955,388 - Mathew , et al. February 17, 2 | 2015-02-17 |
Packaging for semiconductor sensor devices and methods
Grant 8,946,833 - Higgins, III February 3, 2 | 2015-02-03 |
Packaged Semiconductor Device
App 20150001691 - HIGGINS, III; LEO M. | 2015-01-01 |
Thermally enhanced package with lid heat spreader
Grant 8,921,994 - Higgins, III December 30, 2 | 2014-12-30 |
Tin-based Wirebond Structures
App 20140367859 - Carpenter; Burton J. ; et al. | 2014-12-18 |
Copper ball bond features and structure
Grant 8,907,485 - Higgins, III , et al. December 9, 2 | 2014-12-09 |
Encapsulant for a semiconductor device
Grant 8,853,867 - Chopin , et al. October 7, 2 | 2014-10-07 |
Method For Plating A Semiconductor Package Lead
App 20140287554 - HIGGINS, III; LEO M. | 2014-09-25 |
Semiconductor Device
App 20140273352 - Higgins, III; Leo M. ; et al. | 2014-09-18 |
Methods And Structures For Reducing Stress On Die Assembly
App 20140225268 - LEAL; GEORGE R. ; et al. | 2014-08-14 |
Method For Formng A Semiconductor Device Assembly Having A Heat Spreader
App 20140213018 - Higgins III; Leo M. ; et al. | 2014-07-31 |
Semiconductor device assembly having a heat spreader
Grant 8,754,521 - Carpenter , et al. June 17, 2 | 2014-06-17 |
Encapsulant For A Semiconductor Device
App 20140145339 - CHOPIN; Sheila F. ; et al. | 2014-05-29 |
Method for plating a semiconductor package lead
Grant 8,716,066 - Higgins, III May 6, 2 | 2014-05-06 |
Packaging For Semiconductor Sensor Devices And Methods
App 20140110801 - HIGGINS, III; LEO M. | 2014-04-24 |
Thermally Enhanced Package with Lid Heat Spreader
App 20140077349 - HIGGINS, III; Leo M. | 2014-03-20 |
Integrated circuit die assembly with heat spreader
Grant 8,674,509 - Carpenter , et al. March 18, 2 | 2014-03-18 |
Copper Ball Bond Features and Structure
App 20140054781 - Higgins, III; Leo M. ; et al. | 2014-02-27 |
Method For Plating A Semiconductor Package Lead
App 20140038356 - Higgins, III; Leo M. | 2014-02-06 |
Integrated Circuit Die Assembly With Heat Spreader
App 20130320548 - CARPENTER; BURTON J. ; et al. | 2013-12-05 |
Mold Compound Compatibility Test System And Methods Thereof
App 20130319129 - Mathew; Varughese ; et al. | 2013-12-05 |
Method For Forming Die Assembly With Heat Spreader
App 20130221511 - Higgins, III; Leo M. ; et al. | 2013-08-29 |
Semiconductor Devices With Compliant Interconnects
App 20130181340 - UEHLING; Trent S. ; et al. | 2013-07-18 |
Semiconductor Package With A Heat Spreader And Method Of Making
App 20130037931 - HIGGINS, III; LEO M. | 2013-02-14 |
Semiconductor Device With Protective Material And Method For Encapsulating
App 20120273954 - HIGGINS, III; LEO M. | 2012-11-01 |
Thin array plastic package without die attach pad and process for fabricating the same
Grant 7,358,119 - McLellan , et al. April 15, 2 | 2008-04-15 |
Integrated circuit package and method for fabricating same
Grant 7,348,663 - Kirloskar , et al. March 25, 2 | 2008-03-25 |
Integrated circuit package and method for fabricating same
Grant 7,344,920 - Kirloskar , et al. March 18, 2 | 2008-03-18 |
Semiconductor device having a sub-chip-scale package structure and method for forming same
Grant 6,064,114 - Higgins, III May 16, 2 | 2000-05-16 |
Process for underfilling a flip-chip semiconductor device
Grant 5,710,071 - Beddingfield , et al. January 20, 1 | 1998-01-20 |
Method for making a tab semiconductor device with self-aligning cavity and intrinsic standoff
Grant 5,686,352 - Higgins, III November 11, 1 | 1997-11-11 |
Shielded electronic component assembly and method for making the same
Grant 5,639,989 - Higgins, III June 17, 1 | 1997-06-17 |
Pad array semiconductor device having a heat sink with die receiving cavity
Grant 5,583,377 - Higgins, III December 10, 1 | 1996-12-10 |
Tab semiconductor device having die edge protection and method for making the same
Grant 5,583,370 - Higgins, III , et al. December 10, 1 | 1996-12-10 |
Method for forming conductive bumps on a semiconductor device
Grant 5,492,863 - Higgins, III February 20, 1 | 1996-02-20 |
Semiconductor device having compliant columnar electrical connections
Grant 5,468,995 - Higgins, III November 21, 1 | 1995-11-21 |
Z-axis compliant mechanical IC wiring substrate and method for making the same
Grant 5,434,452 - Higgins, III July 18, 1 | 1995-07-18 |
Method for testing a semiconductor device on a universal test circuit substrate
Grant 5,378,981 - Higgins, III January 3, 1 | 1995-01-03 |
Area array semiconductor device having a lid with functional contacts
Grant 5,291,062 - Higgins, III March 1, 1 | 1994-03-01 |
Tape automated bonding(tab)semiconductor device and method for making the same
Grant 5,289,032 - Higgins, III , et al. February 22, 1 | 1994-02-22 |
Tape automated bonding (TAB) semiconductor device with ground plane and method for making the same
Grant 5,221,858 - Higgins, III June 22, 1 | 1993-06-22 |
Semiconductor device with integral decoupling capacitor
Grant 5,212,402 - Higgins, III May 18, 1 | 1993-05-18 |
Semiconductor device having a particular lid means and encapsulant to reduce die stress
Grant 5,173,764 - Higgins, III December 22, 1 | 1992-12-22 |
Elastomeric test probe
Grant 5,134,364 - Karpman , et al. July 28, 1 | 1992-07-28 |
Heat sink apparatus with an air deflection member
Grant 5,132,780 - Higgins, III * July 21, 1 | 1992-07-21 |
Circuit board fabrication
Grant 5,117,069 - Higgins, III * May 26, 1 | 1992-05-26 |
TAB tape translator for use with semiconductor devices
Grant 5,029,325 - Higgins, III , et al. July 2, 1 | 1991-07-02 |
Heat sink apparatus
Grant 5,019,880 - Higgins, III. May 28, 1 | 1991-05-28 |
Circuit board construction
Grant 4,967,314 - Higgins, III October 30, 1 | 1990-10-30 |
High density integrated circuit package
Grant 4,727,410 - Higgins, III February 23, 1 | 1988-02-23 |
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