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Higashiyama; Hideyuki Patent Filings

Higashiyama; Hideyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Higashiyama; Hideyuki.The latest application filed is for "amorphous polyamide resin composition and molded product".

Company Profile
0.2.2
  • Higashiyama; Hideyuki - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Amorphous polyamide resin composition and molded product
Grant 8,476,353 - Higashiyama , et al. July 2, 2
2013-07-02
Amorphous polyamide resin composition and molded product
App 20100076155 - Higashiyama; Hideyuki ;   et al.
2010-03-25
Solar cell module
App 20090178708 - Higashiyama; Hideyuki ;   et al.
2009-07-16

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