Higashitani; Hideki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Higashitani; Hideki.The latest application filed is for "multilayer printed wiring board and method of manufacturing same".

Company Profile

0.12.21

Higashitani; Hideki - Mie JP
Higashitani; Hideki - Kyoto JP
Higashitani; Hideki - Osaka JP
Higashitani; Hideki - Kizu-cho JP
Higashitani; Hideki - Souraku-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multilayer Printed Wiring Board And Method Of Manufacturing Same App 20130168148 - Kanai; Toshinobu ; et al.	2013-07-04
Multilayer Wiring Substrate, And Manufacturing Method For Multilayer Substrate App 20130062101 - Kanai; Toshinobu ; et al.	2013-03-14
Wiring board, method for manufacturing same and semiconductor device Grant 8,071,881 - Higashitani December 6, 2	2011-12-06
Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate Grant 7,968,803 - Higashitani June 28, 2	2011-06-28
Multilayer Wiring Board And Its Manufacturing Method App 20100224395 - Higashitani; Hideki	2010-09-09
Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate App 20100032202 - Higashitani; Hideki	2010-02-11
Wiring Board, Method For Manufacturing Same And Semiconductor Device App 20090133915 - Higashitani; Hideki	2009-05-28
Circuit board and method of manufacturing the same Grant 7,291,915 - Sugawa , et al. November 6, 2	2007-11-06
Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same Grant 7,252,891 - Higashitani August 7, 2	2007-08-07
Semiconductor device with intermediate connector Grant 7,247,508 - Higashitani , et al. July 24, 2	2007-07-24
Method for producing a wiring transfer sheet Grant 7,200,927 - Higashitani April 10, 2	2007-04-10
Multilayer circuit board and method for manufacturing the same Grant 7,132,029 - Nakatani , et al. November 7, 2	2006-11-07
Multilayer circuit board and method for manufacturing the same Grant 7,018,705 - Nakatani , et al. March 28, 2	2006-03-28
Circuit board and method of manufacturing the same App 20060054350 - Sugawa; Toshio ; et al.	2006-03-16
Multilayer circuit board and method for manufacturing the same App 20060008628 - Nakatani; Yasuhiro ; et al.	2006-01-12
Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same Grant 6,946,205 - Higashitani September 20, 2	2005-09-20
Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same Grant 6,926,789 - Higashitani August 9, 2	2005-08-09
Semiconductor device with intermediate connector App 20050142693 - Higashitani, Hideki ; et al.	2005-06-30
Multilayer circuit board and method for manufacturing the same App 20040231151 - Nakatani, Yasuhiro ; et al.	2004-11-25
Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same App 20040202781 - Higashitani, Hideki	2004-10-14
Package of electronic components and method for producing the same App 20040156177 - Higashitani, Hideki	2004-08-12
Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same App 20040151883 - Higashitani, Hideki	2004-08-05
Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same App 20040151884 - Higashitani, Hideki	2004-08-05
Circuit board and method of manufacturing the same Grant 6,748,652 - Andou , et al. June 15, 2	2004-06-15
Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board Grant 6,745,464 - Echigo , et al. June 8, 2	2004-06-08
Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same App 20030203171 - Higashitani, Hideki	2003-10-30
Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board App 20030188428 - Echigo, Fumio ; et al.	2003-10-09
Circuit board and method of manufacturing the same App 20030180512 - Andou, Daizou ; et al.	2003-09-25
Semiconductor device with intermediate connector App 20020180029 - Higashitani, Hideki ; et al.	2002-12-05
Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board App 20020029906 - Echigo, Fumio ; et al.	2002-03-14
Circuit board and method of manufacturing the same App 20010005545 - Andou, Daizou ; et al.	2001-06-28

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